聚焦功率與光電半導體 揭示 AI 伺服器新世代技術與市場趨勢【台灣台北–2025年9月9日】全球最大科技製造平台服務公司鴻海科技集團 (TWSE:2317) 宣布，旗下鴻海研究院與SEMICON Taiwan再度合作，於9月9日在南港展覽館2館舉辦「功率暨光電半導體論壇／NExT Forum 2025」。論壇匯聚全球半導體龍頭，包括德州儀器 (Texas Instruments)、英飛凌 (Infineon)、博通 (Broadcom) 等國際大廠，並將邀請市場研究機構Yole Development帶來針對AI伺服器及資料中心應用、功率與光電半導體的最新市場與技術趨勢洞察。 本屆論壇主題為「Power & Optoelectronics: Unlocking the Future of AI」，除了深入剖析化合物半導體如碳化矽（SiC）、氮化鎵（GaN）在AI伺服器功率解決方案的應用、矽光子技術在AI網路互聯的創新，以及整體產業如何透過高效能功率與光電元件驅動AI數據中心與智慧應用的未來發展外，隨著生成式AI與大型語言模型的運算需求急遽增加，AI伺服器的能源轉換效率、熱管理及高頻高速通訊更成為產業關注焦點。論壇深入探討化合物半導體如何突破功率轉換瓶頸，實現更高能源效率，並透過光電技術支持高速資料傳輸，全面驅動AI產業升級。 鴻海科技集團S事業群總經理陳偉銘指出，化合物半導體正快速成長，市場規模預估將由當前的170億美元，在2030年達到300億美元，展現強勁動能。他進一步強調， 碳化矽在電動車效率與快速充電上已發揮關鍵作用，氮化鎵在5G高頻領域則具備優勢，同時這兩者也是AI伺服器與高效能運算的核心基礎。隨著材料與製程技術的突破，化合物半導體將帶來革命性改變，透過產學研合作加速落地，驅動資料中心、車用電子與新世代智慧應用全面升級。 鴻海研究院半導體研究所今年也在論壇中揭示與國立陽明交通大學(NYCU)、美國伊利諾大學香檳分校(UIUC)最新的共同研究成果。該團隊於第四代半導體 β-氧化鎵 (β-Ga₂O₃)研發中引入(AlₓGa₁₋ₓ)₂O₃間隔層設計，利用能帶工程形成二維電子氣(2DEG)，成功大幅提升元件導通能力與耐壓特性，相關論文已刊登於國際權威期刊《Advanced Electronic Materials》。此技術突破將為未來高功率應用及AI伺服器電源架構帶來全新解決方案。 鴻海研究院半導體研究所所長郭浩中表示：「隨著AI伺服器對能源效率需求不斷攀升，功率半導體的技術突破成為核心關鍵。我們很榮幸能與 NYCU、UIUC 攜手推動第四代半導體研究，未來將持續深耕材料與製程創新，協助AI產業實現高效能、低能耗的發展藍圖。」論壇期間，鴻海研究院也分享了最新在碳化矽、氮化鎵與氧化鎵(Ga₂O₃)等化合物半導體的研發成果，並與業界巨頭共同探討AI伺服器、電動車與新世代通訊的應用挑戰與未來機遇。關於鴻海研究院 鴻海研究院（Hon Hai Research Institute）成立於2020年，隸屬於鴻海科技集團（Hon Hai Technology Group），旗下設有五個研究所及一間實驗室。每個研究單位皆擁有高科技研究專業人員，專注於未來三到七年的前瞻技術研究，以強化鴻海的長期技術與產品創新動能，支持集團轉型為「智慧導向」，並提升鴻海「3+3＋3」營運策略的競爭力。

26 August 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is adopting NVIDIA RTX PRO Servers, an enterprise level data center infrastructure accelerated by NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs. Foxconn will use NVIDIA RTX PRO Servers to accelerate GenAI deployment, agentic workflow design and simulation applications. “Achieving digital transformation in smart manufacturing requires the right foundation and technology. By introducing NVIDIA RTX PRO Servers into our global infrastructure, Foxconn is redefining the boundaries of AI-driven automation – from sophisticated robotics to intelligent logistics, agentic factory operations and smart electric vehicles,” said Young Liu, CEO and Chairman of Foxconn. Foxconn is deploying multiple use cases on RTX PRO Servers, including NVIDIA Omniverse for 3D digital twins to plan and simulate automated production lines, and NVIDIA Isaac for development and simulation of advanced autonomous mobile robots (AMRs). RTX PRO Servers are also featured in the NVIDIAEnterprise AI Factory validated design, empowering Foxconn to rapidly deploy full-stack, enterprise-grade AI infrastructure. Paired with NVIDIA BlueField-3 DPUs and NVIDIA ConnectX-8 SuperNICs, it integrates high-efficiency networking, storage, and cybersecurity accelerators to support a wide range of enterprise applications, including: ●      Industrial AI and robotics simulation (physical AI) ●      Generative AI and LLM inference (agentic AI) ●      Scientific computing and data analytics ●      Industrial design and real-time rendering This will be particularly valuable for Foxconn in advancing smart manufacturing, digital twins, and supply chain optimization. “Modern factories will exist in two worlds: one physical, one digital—perfect twins that look and behave the same,” said Jensen Huang, founder and CEO of NVIDIA. “NVIDIA RTX Pro is the platform of this revolution, built on simulation, graphics, and AI. Foxconn is leading the way, reinventing manufacturing for the era of AI and Omniverse digital twins.” RTX PRO Servers are expected to greatly boost Foxconn development efficiency and edge AI deployments, enabling multiple high-precision simulations to run in parallel and instantly see how different strategies perform. These systems provide Foxconn confidence to explore more complex scenarios and quickly identify the best solutions. For robotics and a wide range of AI applications, this means a smoother, faster path from concept to deployment. Foxconn is also an NVIDIA system partner and offers RTX PRO Servers through its Ingrasys business, based on the MGX reference design with 8 RTX PRO 6000 Blackwell GPUs: https://www.ingrasys.com/solutions/NVIDIA/nvidia_mgx_systems/Read more: https://nvidianews.nvidia.com/news/industry-leaders-transform-enterprise-data-centers-for-the-ai-era-with-nvidia-rtx-pro-servers About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

雙方子公司MFBM與鴻華加入合作 四方共同研發ZEV 強化FUSO品牌實力【台灣台北–2025年８月22日】三菱FUSO卡車・巴士公司（Mitsubishi Fuso Truck and Bus Corporation, MFTBC）與全球最大的科技製造平台服務商──鴻海科技集團（TWSE:2317）今日宣布，雙方已簽署合作備忘錄（MOU），共同投入在零排放巴士（Zero Emission Buses, ZEV）領域的戰略合作，加速日本商用車領導品牌與全球電子產業龍頭在清潔能源交通上的布局。根據合作計畫，雙方將透過旗下子公司，三菱FUSO卡車・巴士製造公司（Mitsubishi Fuso Bus Manufacturing Co., Ltd., MFBM）與鴻華先進科技（Foxtron Vehicle Technologies，TWSE:2258），在ZEV巴士的研發、生產、供應鏈管理與銷售領域展開合作，並以鴻華先進所研發的MODEL T與MODEL U為推進基礎。四家公司將以本次MOU為基礎，進一步探討未來的商業模式，目標是強化FUSO品牌並推動新款「日本製造」巴士的研發。透過此項合作，雙方將提供更多元化的產品，滿足快速演進的巴士市場需求，同時實現永續的業務成長。MFBM將作為主要營運平台，負責在目標市場中，推動巴士的研發、生產與商業化，並將評估引進「日本製造」的內燃機巴士（ICE）及零排放巴士（ZEV）至相關市場。在性能與安全性方面具備卓越實績的全尺寸巴士MODEL T，已於台灣主要城市的公共運輸系統投入商業營運，並獲得大獎肯定。而中型巴士MODEL U則在簡潔設計中，展現高度的靈活性與多功能性，因應不同場景的移動需求。關於三菱FUSO卡車・巴士公司三菱FUSO卡車・巴士公司（MFTBC）是一家位於日本川崎市的商用車製造商。其股份中 89.29%由Daimler Truck AG持有，10.71%由三菱集團旗下多家公司持有。MFTBC 以FUSO品牌提供卡車、巴士及工業用引擎，擁有超過90年的悠久歷史，服務範圍涵蓋全球約170個市場。MFTBC積極研發尖端技術，例如電動化，其eCanter是日本首款量產的電動輕型卡車。此外，MFTBC的重型卡車Super Great也是日本首款搭載相當於SAE Level 2自動駕駛輔助技術的車型，並已成為日本商用車市場的標竿。