26 June 2026, Taipei, Taiwan and Pardubice, the Czech Republic – Hon Hai Technology Group (Foxconn) (TWSE:2317) hosted the Czech Tech Day technology exhibition at its Pardubice facility, showcasing the latest high-tech products shaping the present and future of industry. Visitors had a unique opportunity to see these technologies from Foxconn’s global portfolio in the Czech Republic for the very first time, just days after their presentation at the prestigious VivaTech exhibition in Paris. The event offered a comprehensive overview of the key areas driving today’s technological transformation – from artificial intelligence and advanced robotics to electric mobility. Foxconn also demonstrated its role as a technology leader and strategic business partner, connecting global innovation with local manufacturing. Czech Tech Day was attended by representatives of the City of Pardubice, the Pardubice Region, CzechInvest, the Czech Chamber of Commerce, the Taipei Economic and Cultural Office in Prague, and other important partners. The exhibition was also open to all Foxconn employees from Pardubice and Kutná Hora. AI Infrastructure as the Foundation of the Digital Future One of the main attractions was the presentation of state-of-the-art AI infrastructure, including the NVIDIA Vera Rubin NVL72 platform. This high-performance rack-scale system demonstrated a new approach to building data centers that are evolving into so-called “AI factories” – environments designed for developing, training, and deploying artificial intelligence at scale. “The showcased solutions demonstrated how computational performance can be significantly increased while accelerating model training and reducing both operating costs and energy consumption,” said Radka Svobodová, Compliance, PR and Communications Manager at Foxconn. The exhibition also featured modular infrastructure components illustrating the practical deployment of AI in enterprise environments. Foxconn Czech Republic is already involved in the production of critical AI infrastructure, and this manufacturing capacity will continue to expand in the future. Humanoid Robotics and Digital Twins in Manufacturing Another major highlight was the demonstration of a next-generation humanoid robot developed in cooperation with NVIDIA. The robot is capable of autonomously responding to environmental changes, making decisions, and performing complex tasks such as material handling and assembly operations. The presentation also included a demonstration of the Foxconn Omniverse Digital Twin, which connects physical manufacturing operations with their virtual counterpart in real time. This technology enables process simulation, production optimization, and testing without disrupting actual operations. FOXTRON Electric Vehicles Debut in the Czech Republic Another section of the exhibition was dedicated to EVs from FOXTRON Vehicle Technologies, which were presented in the Czech Republic for the first time. Visitors could explore the compact MODEL B, offering a driving range of up to 516 km, as well as the premium seven-seat MODEL D, designed for both family and business use, with a range of up to 800 km. Both vehicles attracted considerable interest from visitors, who had the opportunity to sit inside the cars, explore their premium interiors, and take photographs with them. “Through both the design and manufacturing of electric vehicles, Foxconn is fulfilling its long-term strategy of being not only a manufacturer of products and components, but also an integrator of comprehensive next-generation mobility solutions that combine hardware, software, and proprietary platforms developed in-house,” said Radka Svobodová. Foxconn’s Strong Presence in the Czech Republic The Czech Tech Day exhibition also showcased European production, including manufacturing activities in the Czech Republic, highlighting the country’s importance within Foxconn’s global operations. Foxconn has been operating in the Czech Republic since 2000, employs approximately 4,500 people, and runs two manufacturing facilities in Pardubice and Kutná Hora. Products manufactured in Foxconn’s Czech facilities include desktop computers, monitors, printers, servers, routers, switches, supercomputers, advanced artificial intelligence systems, and portable oxygen concentrators. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

Osaka, Japan, June 24, 2026 — Hon Hai Technology Group (Foxconn) (TWSE: 2317) today announced the signing of a Strategic Memorandum of Understanding (MOU) with SHARP Corporation (TYO: 6753). Through a clearly defined collaboration framework and communication mechanism, the two companies will leverage Foxconn’s technology capabilities, global manufacturing footprint, supply chain expertise, and investment ecosystem established under its “3+3+3” strategy, together with SHARP’s brand strength, market channels, and customer service network to explore investment opportunities and other forms of collaboration, accelerating new business development and market expansion. The MOU covers a broad range of strategic areas, including AI infrastructure and solutions, energy and ESG-related applications, robotics and intelligent automation systems, next-generation communications technologies, and smart city initiatives. The two companies will jointly develop innovative products and services to address evolving market needs. As a priority initiative, the companies will evaluate the establishment of a “3+3+3” Joint R&D Platform, combining SHARP’s new business initiatives with Foxconn’s capabilities in AI, energy, robotics, electric vehicles, and next-generation communications. The platform will support joint R&D, proof-of-concept validation, product development, and commercialization efforts. The two companies will also evaluate a business development collaboration platform to accelerate new business deployment by combining SHARP’s market strengths with Foxconn’s manufacturing capabilities, supply chain resources, and global partner network. In AI infrastructure, the companies will build on SHARP’s AI server initiative and explore AI server products and solutions under the SHARP brand, integrating product supply, maintenance services, deployment support, and related business models to meet growing demand for high-performance computing and AI applications. Young Liu, Chairman of Hon Hai Technology Group (Foxconn), said: “As an important affiliated company of the Hon Hai Technology Group (Foxconn), SHARP possesses strong brand value and a solid market foundation. Through this collaboration framework, we look forward to creating synergies between our organizations and developing new business models in growth sectors such as AI, energy, and robotics, further enhancing SHARP’s corporate value and the overall competitiveness of the Foxconn Group.” Tetsuji Kawamura, President and Chief Executive Officer of SHARP Corporation, said: “SHARP has built a strong presence in Japan and global markets. Through this collaboration, we look forward to leveraging Foxconn’s strengths in technological innovation and global supply chain management to drive new business development and create new growth opportunities.” Looking ahead, SHARP and Foxconn will use this MOU as a foundation for future collaboration. Guided by market demand and industry trends, the two companies will continue to advance collaborative initiatives and pursue opportunities that create long-term value.▲ Photo Caption: Witnessed by Foxconn Chairman Young Liu (center), Foxconn and SHARP signed a Strategic MOU. (Photo courtesy of Foxconn)

18 June 2026, Taipei, Taiwan – Hon Hai Research Institute (HHRI) today announced a major breakthrough in its Post-Quantum Cryptography (PQC) research and development. SNOVA, a digital signature algorithm co-developed with deep involvement from HHRI experts, has officially been selected for the third round of the onramp competition of the U.S. National Institute of Standards and Technology (NIST) PQC Standardization Project. Following the technical prowess previously demonstrated by Preon—another candidate algorithm involving HHRI participation—SNOVA's advancement further validates the global cryptographic community's recognition of the Institute's core technological strengths. It signifies that the HHRI team has fully mastered critical, next-generation capabilities in cybersecurity defense. Professor Lih-Chung Wang, a key contributor to the SNOVA algorithm, is currently seconded to HHRI as a Distinguished Researcher. During the secondment period, Professor Wang collaborated closely with the Information Security Research Center's cybersecurity team to investigate hardware acceleration strategies and optimization methods for the mathematical structure underlying SNOVA. In addition to delivering the core advantages of "short signatures" and "low computational overhead" inherent to its algorithm family, SNOVA achieves a critical breakthrough in its "small public key" characteristic. This breakthrough substantially improves the algorithm's universal versatility across diverse application scenarios and boosts hardware computing efficiency. This crucial edge was strategically targeted by the team from an early stage and stands as a pivotal factor in winning NIST's favor and securing its advancement to the third round. Simultaneously holding two pioneering candidate technologies, SNOVA and Preon, reflects HHRI's strategic, multi-path deployment across several post-quantum technological trajectories, encompassing Lattice-based, Multivariate (MQ), and Zero-Knowledge Proof (ZKP) cryptographic frameworks. This multi-path approach aligns perfectly with NIST's overarching strategy of ensuring algorithmic diversity, while granting Hon Hai Technology Group (Foxconn), the parent of HHRI, the research caliber to participate in international standard-setting across diverse technological dimensions. Faced with a future full of uncertainties, this parallel multi-track strategy effectively serves as a multi-layered insurance policy for Foxconn. The NIST PQC Standardization Project is universally acknowledged as the world's most authoritative and influential screening mechanism for post-quantum cryptography. Algorithms submitted by countless top-tier scientists and institutions globally undergo rigorous, multi-round elimination. Advancing to the third round indicates that SNOVA has successfully withstood the most stringent cryptanalysis from the world's leading cryptographers. This achievement proves that HHRI's capabilities in "Quantum Security" are truly world-class, demonstrating its global-tier scientific research strength in cutting-edge, core software cryptography and forward-looking cybersecurity R&D. Looking ahead, Foxconn through HHRI will continue to invest resources in strengthening the security analysis and implementation of SNOVA, fostering its further development and adoption. This milestone is not only a successful paradigm of industry-academia collaboration in Taiwan, but also marks the Group's commitment to transforming into a "Cybersecurity Technology Pioneer," dedicated to providing clients with the most robust and reliable foundational technological protection as the world transitions into the quantum computing era.