Clarivate sees AI standing out in innovation activity09 April 2026, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturer and leading technology service provider, has been named in Clarivate’s Top 100 Global Innovators 2026, a milestone for the ninth year running and as the accelerating role of artificial intelligence stood out in innovation activity among peers in the prestigious ranking.   Known as the 1% of the 1%, the Top 100 Global Innovators navigate complexity with clarity and set the pace for invention quality, originality and global reach. In 2026, Foxconn was ranked 35th and part of the leading sector of electronics and computing that represented 27% of the list. From Taiwan, Foxconn was top ranked among non-semiconductor Taiwanese peers.   Mick Lin, Director of the IP Affairs Division at Foxconn said, “Our patent filings grew 15% on-year last year, with AI technology behind some of the IP. At the same time, our inventors, engineers and administrators are able to accelerate their patent application efficiency and related analysis work due to AI-enabled processes.”   Maroun S. Mourad, President, Intellectual Property, Clarivate, said: “Recognition as a Top 100 Global Innovator is a remarkable achievement given the pace of change. Multi-year winners and new entrants are investing in AI innovation as it redefines the boundaries between research, engineering and commercial execution. The leaders we celebrate today are not just responding to this shift, they are designing for it.”   The Top 100 Global Innovators account for a disproportionate share of the world’s most valuable ideas, demonstrating that innovation leadership is defined by precision and strategic intent. This year’s ranking not only celebrates enduring innovation leadership, but it also reveals the forces reshaping that leadership, with AI at the forefront. The Top 100 Global Innovators contribute an exceptional 16% of the world’s highest-strength AI inventions.   The Top 100 Global Innovators analysis is underpinned by the Clarivate Center for IP and Innovation Research. Their analyses are founded in rigorous research leveraging the proprietary Derwent Strength Index, derived from the Derwent World Patents Index (DWPI) and its global invention data to measure the influence of ideas, their success and rarity, and the investment in inventions.   Clarivate is a leading global provider of transformative intelligence, identifies and ranks theorganizations that consistently deliver high-impact inventions, shaping the future of innovation across industries. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long- term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises.

16 March 2026, San Jose, California, and Taipei, Taiwan– Hon Hai Technology Group (“Foxconn”) (TWSE:2317) plans to accelerate the adoption of next generation enterprise AI across the Asia-Pacific (APAC) region in strategic partnership with SAP SE, a global leader in enterprise applications and business AI. The partnership, announced at NVIDIA GTC 2026 in San Jose, builds on Foxconn’s ongoing AI Factory initiative, aimed at reshaping the future of manufacturing processes and supply chain management and opening new pathways for global deployment. With this partnership, Foxconn and SAP will bring together their respective technologies to help accelerate go-to-market initiatives across the APAC region and advance the deployment of AI technologies that support Foxconn’s journey toward becoming a fully digitized and AI-empowered organization. The companies will also explore new co-innovation use cases for Physical AI, SAP Supply Chain Management, and Foxconn Smart Manufacturing. “Our strategic partnership with SAP is an important step toward realizing the vision of intelligent and AI-powered manufacturing,” said Young Liu, Chairman of Foxconn. “By bringing together Foxconn’s AI computing capabilities with SAP’s expertise in enterprise applications, we are addressing one of the most complex challenges facing global industries today.” "AI is advancing at an unprecedented pace, and our partnership with Foxconn represents a powerful opportunity to accelerate enterprise AI adoption across the Asia-Pacific region," said Christian Klein, CEO of SAP SE. “Together, we are helping organizations harness technology that helps them move faster, operate more efficiently, and scale with confidence as they transform in the AI era." Looking ahead, Foxconn aims to work with SAP to help redefine how industries harness enterprise AI. By bringing together enterprise intelligence, AI infrastructure, and new pathways for real-world industrial deployment, the collaboration aims to establish a new blueprint for AI-powered manufacturing.       About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   SAP and other SAP products and services mentioned herein as well as their respective logos are trademarks or registered trademarks of SAP SE in Germany and other countries. Please see https://www.sap.com/copyright for additional trademark information and notices. All other product and service names mentioned are the trademarks of their respective companies.  

16 March 2026, San Jose, California, and Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today confirmed its unrivalled role in pacing the AI industrial revolution by exhibiting full-system AI server racks for NVIDIA Vera Rubin NVL72 platform, and, for the first time in the United States, unveiling details of its industrial humanoid robots and scalable modular data centers at NVIDIA GTC 2026. Splashing out on technology at the premier conference on artificial intelligence, the world’s largest electronics manufacturer demonstrated its deep collaboration with NVIDIA and its in-house strength in vertical integration with an array of critical components and cutting-edge systems that power NVIDIA Vera Rubin NVL72 platform. “Foxconn’s vertical integration, precision manufacturing and future technologies come into sharp relief when we work with NVIDIA year after year. This powerful partnership enables AI factories to produce intelligence efficiently and reliably for large-scale training, inference, and agentic workloads,” said Foxconn Chairman Young Liu. Double the size of the year before, the Foxconn delegation, with over a hundred executives, engineers and scientists, at San Jose this year brings expertise on the latest advances in AI factories and physical AI, sharing the newest innovations for NVIDIA HGX and NVIDIA MGX platforms. At GTC Booth 1921, the end-to-end NVIDIA AI Factory Ecosystem showcase features Foxconn’s key building blocks across mechanical design, cooling components, and power delivery that come together to accelerate integration and support rapid deployment. Foxconn will support the latest NVIDIA RTX PRO™ 4500 Blackwell Server Edition GPUswith new servers to power demanding data processing, AI, video and visual computing workloads. For the first time in the United States, Foxconn unveiled details of its AI-powered industrial humanoid robot being developed in collaboration with NVIDIA. Both at Foxconn’s booth and GTC sessions – “Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem” and “Building and Scaling AI Factories With Digital Twins and Robotics” – Foxconn experts show how the robots autonomously execute high-precision, repetitive industrial operations – including pick-and-place, screw fastening, and material handling – demonstrating reliability and operational efficiency in real-world conditions. The robotic skills derived from actual factory scenarios are the result of combining simulation-based training with on-site iteration, leveraging NVIDIA Isaac GR00T, NVIDIA FoundationPose, NVIDIA Isaac Sim and NVIDIA Jetson Thor, to enable rapid deployment and scalable rollout across manufacturing facilities. Meanwhile, the modular data center, or MDC, redefines scalability. Foxconn, with partners, are launching a new generation of AI-ready modular and hybrid architectures to meet demand from new-generation AI models for ultra-high-density compute power and electrical infrastructure. Through highly standardized and modular designs – see a small-scale model at Booth 1921 – the complex construction of an AI data center is transformed into a replicable and expandable industrialized solution, accelerating the journey for enterprises from building compute power to realizing the business value of AI. Foxconn’s Visionbay.ai, as an NVIDIA Cloud Partner (NCP), strategically collaborates with ecosystem leaders, enabling a unified “AI+Workflow” deployment architecture – bridging foundation models, platforms, applications, and compute infrastructure. Executing a global AI infrastructure strategy exceeding 1GW of deployed capacity, Foxconn is scaling from Taiwan into strategic regions worldwide, establishing strong foundations for sovereign AI. Another capability on display at GTC is Genesis, Foxconn’s WEF-recognized AI initiative. Powered by NVIDIA Omniverse and Foxconn FactoryGPT, Genesis demonstrates a fully integrated digital-physical factory. Visitors experience how AI simulates optimal strategies within digital twins and feeds decisions back to real-world production lines – forming a continuous closed-loop optimization cycle. In Smart City, Foxconn’s CityGPT integrates with NVIDIA Metropolis to advance AI-powered transportation and safety, while Smart EV features enhancing ADAS capabilities involving FoxBrain, the Group’s proprietary, traditional Chinese large-language model. Foxconn’s integrated healthcare AI ecosystem on exhibit focuses on four clinical domains, including scrub nurse collaborative robotics, colonoscopy Agentic AI, cardiovascular digital twins, and multimodal precision treatment for breast cancer. These take medical AI from standalone model applications to a fully realized agentic AI healthcare system – capable of perception, reasoning, and action – enabling scalable clinical innovation. On March 17, GTC session Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q is dedicated to breakthroughs in quantum by the Hon Hai Research Institute, Foxconn’s R&D powerhouse looking at future technologies. Information on exhibit hall and hours can be found here. Foxconn GTC sessions and visit Booth 1921 1.    Building and Scaling AI Factories With Digital Twins and Robotics [S81508] 2.    Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem [S82100] 3.    Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q [S82043]     About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com