16 March 2026, San Jose, California, and Taipei, Taiwan– Hon Hai Technology Group (“Foxconn”) (TWSE:2317) plans to accelerate the adoption of next generation enterprise AI across the Asia-Pacific (APAC) region in strategic partnership with SAP SE, a global leader in enterprise applications and business AI. The partnership, announced at NVIDIA GTC 2026 in San Jose, builds on Foxconn’s ongoing AI Factory initiative, aimed at reshaping the future of manufacturing processes and supply chain management and opening new pathways for global deployment. With this partnership, Foxconn and SAP will bring together their respective technologies to help accelerate go-to-market initiatives across the APAC region and advance the deployment of AI technologies that support Foxconn’s journey toward becoming a fully digitized and AI-empowered organization. The companies will also explore new co-innovation use cases for Physical AI, SAP Supply Chain Management, and Foxconn Smart Manufacturing. “Our strategic partnership with SAP is an important step toward realizing the vision of intelligent and AI-powered manufacturing,” said Young Liu, Chairman of Foxconn. “By bringing together Foxconn’s AI computing capabilities with SAP’s expertise in enterprise applications, we are addressing one of the most complex challenges facing global industries today.” "AI is advancing at an unprecedented pace, and our partnership with Foxconn represents a powerful opportunity to accelerate enterprise AI adoption across the Asia-Pacific region," said Christian Klein, CEO of SAP SE. “Together, we are helping organizations harness technology that helps them move faster, operate more efficiently, and scale with confidence as they transform in the AI era." Looking ahead, Foxconn aims to work with SAP to help redefine how industries harness enterprise AI. By bringing together enterprise intelligence, AI infrastructure, and new pathways for real-world industrial deployment, the collaboration aims to establish a new blueprint for AI-powered manufacturing.       About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   SAP and other SAP products and services mentioned herein as well as their respective logos are trademarks or registered trademarks of SAP SE in Germany and other countries. Please see https://www.sap.com/copyright for additional trademark information and notices. All other product and service names mentioned are the trademarks of their respective companies.  

16 March 2026, San Jose, California, and Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today confirmed its unrivalled role in pacing the AI industrial revolution by exhibiting full-system AI server racks for NVIDIA Vera Rubin NVL72 platform, and, for the first time in the United States, unveiling details of its industrial humanoid robots and scalable modular data centers at NVIDIA GTC 2026. Splashing out on technology at the premier conference on artificial intelligence, the world’s largest electronics manufacturer demonstrated its deep collaboration with NVIDIA and its in-house strength in vertical integration with an array of critical components and cutting-edge systems that power NVIDIA Vera Rubin NVL72 platform. “Foxconn’s vertical integration, precision manufacturing and future technologies come into sharp relief when we work with NVIDIA year after year. This powerful partnership enables AI factories to produce intelligence efficiently and reliably for large-scale training, inference, and agentic workloads,” said Foxconn Chairman Young Liu. Double the size of the year before, the Foxconn delegation, with over a hundred executives, engineers and scientists, at San Jose this year brings expertise on the latest advances in AI factories and physical AI, sharing the newest innovations for NVIDIA HGX and NVIDIA MGX platforms. At GTC Booth 1921, the end-to-end NVIDIA AI Factory Ecosystem showcase features Foxconn’s key building blocks across mechanical design, cooling components, and power delivery that come together to accelerate integration and support rapid deployment. Foxconn will support the latest NVIDIA RTX PRO™ 4500 Blackwell Server Edition GPUswith new servers to power demanding data processing, AI, video and visual computing workloads. For the first time in the United States, Foxconn unveiled details of its AI-powered industrial humanoid robot being developed in collaboration with NVIDIA. Both at Foxconn’s booth and GTC sessions – “Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem” and “Building and Scaling AI Factories With Digital Twins and Robotics” – Foxconn experts show how the robots autonomously execute high-precision, repetitive industrial operations – including pick-and-place, screw fastening, and material handling – demonstrating reliability and operational efficiency in real-world conditions. The robotic skills derived from actual factory scenarios are the result of combining simulation-based training with on-site iteration, leveraging NVIDIA Isaac GR00T, NVIDIA FoundationPose, NVIDIA Isaac Sim and NVIDIA Jetson Thor, to enable rapid deployment and scalable rollout across manufacturing facilities. Meanwhile, the modular data center, or MDC, redefines scalability. Foxconn, with partners, are launching a new generation of AI-ready modular and hybrid architectures to meet demand from new-generation AI models for ultra-high-density compute power and electrical infrastructure. Through highly standardized and modular designs – see a small-scale model at Booth 1921 – the complex construction of an AI data center is transformed into a replicable and expandable industrialized solution, accelerating the journey for enterprises from building compute power to realizing the business value of AI. Foxconn’s Visionbay.ai, as an NVIDIA Cloud Partner (NCP), strategically collaborates with ecosystem leaders, enabling a unified “AI+Workflow” deployment architecture – bridging foundation models, platforms, applications, and compute infrastructure. Executing a global AI infrastructure strategy exceeding 1GW of deployed capacity, Foxconn is scaling from Taiwan into strategic regions worldwide, establishing strong foundations for sovereign AI. Another capability on display at GTC is Genesis, Foxconn’s WEF-recognized AI initiative. Powered by NVIDIA Omniverse and Foxconn FactoryGPT, Genesis demonstrates a fully integrated digital-physical factory. Visitors experience how AI simulates optimal strategies within digital twins and feeds decisions back to real-world production lines – forming a continuous closed-loop optimization cycle. In Smart City, Foxconn’s CityGPT integrates with NVIDIA Metropolis to advance AI-powered transportation and safety, while Smart EV features enhancing ADAS capabilities involving FoxBrain, the Group’s proprietary, traditional Chinese large-language model. Foxconn’s integrated healthcare AI ecosystem on exhibit focuses on four clinical domains, including scrub nurse collaborative robotics, colonoscopy Agentic AI, cardiovascular digital twins, and multimodal precision treatment for breast cancer. These take medical AI from standalone model applications to a fully realized agentic AI healthcare system – capable of perception, reasoning, and action – enabling scalable clinical innovation. On March 17, GTC session Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q is dedicated to breakthroughs in quantum by the Hon Hai Research Institute, Foxconn’s R&D powerhouse looking at future technologies. Information on exhibit hall and hours can be found here. Foxconn GTC sessions and visit Booth 1921 1.    Building and Scaling AI Factories With Digital Twins and Robotics [S81508] 2.    Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem [S82100] 3.    Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q [S82043]     About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

·   Advance development of competitive, zero-emission buses in Japan ·   Combines FUSO’s bus design, development and manufacturing expertise with Foxconn’s ZEV technology and global partnership network ·   New company to be established from H2 2026Mitsubishi Fuso Truck and Bus Corporation (Headquarters: Kawasaki City, Kanagawa Prefecture, President and CEO: Karl Deppen, hereafter: MFTBC) today announced plans to create a standalone bus company with partner Hon Hai Technology Group (TWSE:2317), Headquarters: Tucheng, New Taipei City, Chairman and CEO Young Liu, hereafter: Foxconn). Katsuto Kora (currently Director, Head of FUSO BUS, Mitsubishi Fuso Truck & Bus Corporation) is designated as the new company’s CEO.   The two companies previously announced the signing of a memorandum of understanding to explore strategic collaboration in zero emission, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer. Via their subsidiaries - Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – MFTBC and Foxconn plan to cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.   Today’s announcement marks the next stage in the companies’ collaboration. The new company aims to fulfil society’s demand for high quality public transportation by accelerating the development of competitive, zero-emission buses in addition to the current diesel lineup. The buses will be developed and manufactured at the company’s plant in Toyama under the FUSO name, which already has over 90 years of heritage as a CV brand. The company will be headquartered in Kawasaki, Japan.   As a bus-dedicated OEM, the new company will focus on quickly developing and launching EV buses for domestic and international markets, while continuing to improve the conventional ICE portfolio.   With local development, sourcing, production and sales channels, the company will also be able to smoothly comply with Japanese regulations, quality standards and customer needs. This will be backed by Foxconn’s ZEV expertise, high-tech competency and global partnership network to help ensure products are successful in Japan and abroad.   Karl Deppen, CEO of MFTBC: “We are excited to join forces with Foxconn. This collaboration will combine the strengths of both parties to accelerate our transformation in the bus sector. By combining FUSO and Foxconn’s extensive experience and technological know-how, we will offer customers state-of-the art solutions for public transport, thereby contributing to society both in Japan and abroad.”   “Mobility is a strategic priority for Foxconn,” said Jun Seki, Foxconn Chief Strategy Officer for EVs. “This collaboration with MFTBC will provide a comprehensive electrification solution for Japan’s transportation ecosystem. This approach will significantly shorten development cycles and enhance cost-efficiency.”   Katsuto Kora, designated CEO of New Bus OEM: “The new joint venture will integrate the corporate cultures of both companies, blending Japan’s spirit of manufacturing excellence with Foxconn’s agility and technological prowess. Given the extensive existing partnerships of both shareholders, we expect even broader collaboration opportunities in the field of future technologies in the years to come. Our focus will be on meeting customer expectationsnot only for current conventional ICE improvement but also for zero-emission transportation and leading FUSO bus into a new era of digitalization and electrification.”   Having signed the definitive agreements today, MFTBC and Foxconn aim to close the transaction in the second half of 2026. The transaction is subject to all parties involved reaching an agreement and receiving approval from the relevant Boards, shareholders and authorities. MFTBC at a Glance Mitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.   Foxconn at a Glance Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   Foxtron at a Glance Established in 2020, Foxtron Vehicle Technologies is Taiwan’s only company with full vehicle design, development, and system validation capabilities. Leveraging decades of expertise from Hon Hai Technology Group (Foxconn) and Yulon Group in the ICT and automotive industries, Foxtron operates under the CDMS (Contract Design and Manufacturing Service) business model. With an open platform strategy, Foxtron aims to “Root in Taiwan, Expand Globally”, working alongside Taiwan’s ICT and automotive industries to drive international expansion and establish the next-generation EV ecosystem.   MFBM at a Glance Founded in1950, Mitsubishi Fuso Bus Manufacturing (MFBM) has been delivering high-quality buses to satisfied customers for over 75 years. With a state-of-the-art production facility located in Toyama, the company has achieved certification to international quality and environmental standards (ISO9001 since 2001, ISO14001 since 2003 and ISO/IATF16949 since 2018). MFBM manufactures its light duty ‘Rosa’ bus in dozens of markets worldwide and also produces large buses for both the long-distance coach (Aero Queen/Aero Ace) and city (Aero Star) segments.