（Shared from the Institute for Biotechnology and Medicine Industry）With nursing shortages reaching critical levels globally, Foxconn's Nurabot deployment marks a pivotal moment where manufacturing expertise meets healthcare innovation, promising to restore the human touch in medical care by liberating staff from routine logistics. In a significant move that underscores its strategic pivot into next-generation industries, Taiwan’s manufacturing giant Foxconn is poised to deploy its healthcare robot, Nurabot, in hospitals across Taiwan starting this October. This launch is a foundational component of Foxconn’s ambitious Smart Hospital initiative, a long-term vision designed to harness the power of AI, robotics, and digital integration to fundamentally transform the healthcare ecosystem. The Nurabot is the result of a powerful collaboration between Foxconn, renowned Japanese robotics firm Kawasaki, and the Taichung Veterans’ General Hospital (TCVGH). This partnership is more than a technical venture; it represents a commitment to creating a future where technology serves as a seamless extension of human care. According to Barry Chiang, Foxconn’s Chief of Digital Health and President of its B Business Group and a key leader in this transformation, the Nurabot is a pivotal step toward a new era. “The robot will be in service after completing the ongoing stress test at TCVGH, and with deployment completed by year end, we expect to launch the total solution in 2026, just in time for the government’s Healthy Taiwan Cultivation Plan,” Chiang stated during an exclusive interview with the Institute for Biotechnology and Medical Industry (IBMI). A Solution Born from User-Centric Design Foxconn’s foray into healthcare is not a simple transfer of its industrial robotics expertise. While the company is a global leader in producing robotic arms for “lighthouse factories” and complex manufacturing lines, it recognized from the outset that medical environments are vastly different. Robots in a hospital must meet stringent safety, regulatory, and user experience requirements that are far more complex than those on a factory floor. This understanding led to a unique, user-centric “design-thinking” approach. The journey began in 2022 when Chiang established a new organization, which later became the Taiwan Digital Health Alliance (HiMEDt). Rather than starting with a product, his team began by deeply embedding themselves in the very environments they hoped to improve. They conducted in-depth visits to key hospitals across Taiwan, communicating directly with doctors and nurses to map a comprehensive understanding of their daily challenges.First-hand observations at the Taichung Veterans’ General Hospital were particularly illuminating. The research team discovered a striking inefficiency: nursing staff spent an estimated 30-40% of their valuable time on logistical tasks—delivering specimens, blood bags, and medicines. The rest of their day was equally demanding, consumed by critical, patient-facing duties such as providing health education, conducting routine rounds to check patient conditions, and listening for subtle sounds to prevent accidents like falls. This insight proved that offloading routine, repetitive tasks would not simply increase efficiency; it would free up nurses to focus on the human elements of care that technology cannot replicate. To translate these insights into a viable product, Foxconn assembled a truly multidisciplinary team. It included not only AI algorithm engineers and industrial designers but also user interface designers and project managers with specialized biotech backgrounds. This diverse expertise ensured that the robot was not only technologically sound but also intuitive for medical staff and compliant with all necessary regulations. The Technology Powering Nurabot At its core, the Nurabot is a sophisticated autonomous mobile robot (AMR) engineered to address the specific pain points identified in the user research. Its primary function is to reduce the workload of nursing staff by autonomously delivering blood and urine specimens and carrying temperature-sensitive blood bags in a dedicated, low-temperature storage trunk. To guarantee security and accuracy, the robot is equipped with biometric mechanisms, ensuring that critical medical supplies are delivered to the correct person at the right location, every time. One of Nurabot’s most impressive features is its seamlessly integrated four-cloud architecture, built on NVIDIA’s three computing platforms—Omniverse, Isaac Sim, and Jetson—and directly connected to the hospital HIS system to enable automated task dispatching. While this may appear straightforward, it is powered by a complex, multi-layered computing framework that Barry Chiang poetically described as a “chorus.”  To achieve this perfect harmony, Nurabot leverages four distinct "clouds" working in unison: FoxBrain: Foxconn’s proprietary large language model, which serves as the robot’s central cognitive engine. Digital Twin Environment (Omniverse): A collaborative simulation and testing environment built on NVIDIA Omniverse, enabling continuous validation and optimization of Nurabot’s performance through digital twin modeling. NVIDIA Jetson AGX Orin: This powerful AI-at-the-edge computing platform allows Nurabot to process sensory data in real time, enabling it to navigate complex hospital environments, avoid obstacles, and make immediate, safe decisions. The Hospital's Private Cloud (HIS): This system integrates the robot directly into the hospital's internal network, allowing it to receive orders and securely access necessary information. In a hospital environment that operates 24/7, reliability is paramount. Nurabots are designed for continuous service, powered by swappable batteries that can be exchanged instantly at a charging station. This simple but critical feature ensures that a Nurabot is always ready for its next mission, minimizing downtime and maintaining the flow of operations. Aligning with Taiwan's National Vision Foxconn is strategically launching the Nurabot service in collaboration with key medical institutions, including Taichung Veterans’ General Hospital and the Matzu Hospital in Baishatun. This initial rollout has already generated significant interest, with major hospitals like Shin Kong Hospital and Kaohsiung Medical School Hospital expressing a desire to collaborate. The timing of this initiative could not be more perfect, as it aligns directly with Taiwan’s Healthy Taiwan Cultivation Plan. This five-year, NT$48.9 billion (US$1.61 billion) government initiative is aimed at accelerating the digital transformation of the country’s medical landscape. While many hospitals are eager to participate and secure a portion of the funding, very few qualified providers are capable of delivering a comprehensive, full-scale solution like the one being offered by Foxconn. The Nurabot is just one piece of this larger vision. Foxconn has also collaborated with hospitals like New Taipei Municipal TuCheng Hospital and Taipei Veterans’ General Hospital to build cancer and disease datasets for AI models called CoDoctor AI. This work is a testament to the company’s broader 3+3+3 strategy, which identifies digital health and robotics as two of its three future megatrends, with AI as one of its core technologies. By leveraging its vast computing power and infrastructure, Foxconn is positioning itself as the ideal partner for hospitals seeking to qualify for government funding and lead the charge in the digital transformation of healthcare. The deployment of Nurabot is a tangible manifestation of Foxconn's strategic evolution. It’s not just about building a product; it’s about pioneering a new model for healthcare that could address critical global challenges like nursing shortages and burnout. As Nurabot begins its service in Taiwan, it will serve as a powerful proof of concept for a future where technology empowers, rather than replaces, human caregivers.  

Point2’s Pioneering e-Tube RF Interconnect Platform Breaks Barriers of Copper and Optical Cabling to Accelerate AI Cluster Scale-Up in Hyperscale Data CentersSAN JOSE, Calif., Oct. 14, 2025 – Point2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for scalable interconnects in AI data centers, will showcase its latest advancements in e-Tube™ RF rack-scale data transmission over plastic waveguides at the upcoming Open Compute Project (OCP) Global Summit, held October 13–16 at the San Jose Convention Center. As an active contributor to OCP’s mission of open innovation, Point2 will present its vision for next-generation AI infrastructure through technical sessions and live demonstrations.   Point2’s patented e-Tube RF platform delivers a compelling alternative to copper and optics, offering 10x cable reach of copper at a similar cost structure, while 3x lower cost and power and 1000x lower in latency than traditional optical interconnect, creating a new category in AI interconnect. At the heart of Point2’s showcase is its rapidly expanding e-Tube cable and connectorization ecosystem, developed in collaboration with Molex and Foxconn Interconnect Technology (FIT). This ecosystem enables seamless integration of e-Tube into standard data center architectures, accelerating deployment and scalability for hyperscale and enterprise AI clusters.   Key Use Cases to Be Highlighted at OCP: OSFP Pluggable Active RF Cable (ARC): Point2 will present the e-Tube ARC cable for intra-rack and cross-rack interconnects, offering plug-and-play compatibility of the MSA OSFP form factor. Rack-Scale Compute Fabric Interconnect: Point2 will also showcase e-Tube as the transformative RF alternative to copper in backplanes with a simple yet elegant approach to connecting GPU accelerators through the compute fabric for AI cluster scale-up.   “AI workloads are pushing the limits of conventional interconnect technologies,” said Dr. Sean Park, Co-Founder and CEO of Point2 Technology. “With e-Tube, we’re leaping past the copper cliff and avoiding the optical penalties to deliver a scalable, low-latency, energy-efficient interconnect platform. Our collaboration with Molex and FIT ensures that e-Tube will be ready for demanding rack-scale deployments.”   “FIT is excited to partner with Point2 to bring e-Tube technology into mainstream rack-level deployments,” said Julia Jiang, VP of Marketing and Sales at FIT, “Our joint efforts will help data center operators achieve higher performance and lower power consumption while simplifying interconnect architecture which can deliver copper like reliability and economics to our customers.”   “Molex is proud to lead the innovation of high-performance connector and cable solutions that enable Point2’s e-Tube solutions to meet the demands of next-generation data centers,” said Chad Jameson, General Manager, I/O Solutions at Molex. “Together, we’re enabling highly reliable, scalable, and manufacturable AI interconnects for next-generation AI data centers.”   Point2 Technology will participate in the OCP Global Summit with a speaking session by Dr. Sean Park, and a presence in the Innovation Village, and at a private suite at the Hilton San Jose where the company will showcase its latest technologies. Additional details as follows:   Speaking Session: “Leap Over the Copper Cliff and Avoid the Optical Penalties to Scale Up AI Clusters” Dr. Sean Park, Co-Founder & CEO of Point2 Technology, will address the physical and economic boundaries of copper and optical interconnects—and how e-Tube technology overcomes these limitations to enable scalable, energy-efficient AI cluster scale up.   Date: Wednesday, October 15 Time: 1:55 – 2:15 PM PST Location: SJCC – Concourse Level – 210ABEF   Live Demonstrations in the Innovation Village Point2 will also demonstrate its ground-breaking e-Tube technology in the FTS Emerging Technology section of the Innovation Village on the OCP Exhibition floor. Attendees can witness live demos of e-Tube interconnects and engage directly with Point2’s leadership team.   Live Demonstrations at the Hilton San Jose Private Suite Point2 will also host private meetings with demonstrations of its e-Tube ARC, AEC, and roadmap discussion. Contact sales.us@point2tech.com to schedule a meeting.   About Point2 Technology Point2 Technology, headquartered in San Jose, Calif., designs and manufactures ultra-low power, low-latency, point-to-point interconnect and range enhancement SoC solutions purpose-built to meet the bandwidth requirements of hyperscale AI/ML datacenters and edge cloud infrastructure. Founded by an accomplished team from Marvell, Finisar, and Samsung, Point2 is a leading innovator that is reimagining data center and 5G cloud infrastructure interconnect in the multi-terabit era. www.point2tech.com.   About Foxconn Interconnect Technology Limited (FIT Hon Teng Limited) Foxconn Interconnect Technology Limited (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Asia. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, Mobility, and Audio, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com   About Molex Molex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 38 countries, Molex enables transformative technology innovation in the consumer device, aerospace and defense, data center, cloud, telecommunications, transportation, industrial automation and healthcare industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life. For more information, visit www.molex.com.

14 October 2025, San Jose, California – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced it is collaborating with NVIDIA to implement the 800 VDC power architecture for AI factories announced at Computex 2025, marking the next step toward modern AI factory infrastructure. Foxconn’s subsidiary Ingrasys Technology showcased the latest NVIDIA GB300 NVL72 platform, integrated with an In-row CDU solution to achieve new levels of energy efficiency. Through continuous innovation in high-efficiency power and thermal design, Foxconn reinforces its leadership and highlights Taiwan’s pivotal role in the global AI supply chain. The new architecture will first be implemented in the Kaohsiung K-1 artificial intelligence data center project, which serves as a demonstration site for the Group’s capabilities in AI servers, data centers and renewable-energy integration and further solidifies Taiwan’s strategic position in the global AI supply chain. The latest collaboration between the bellwether technology partners, announced at the OCP Global Summit 2025 where Foxconn subsidiary Ingrasys also unveiled its latest NVIDIA GB300 NVL72 platform, highlights the Group’s commitment to deliver safer, more energy-efficient, and rapidly deployable AI factory and data center solutions. The 800 VDC power architecture is purpose-built for high-density AI workloads. It features a modular and scalable design that significantly reduces current and resistive losses, minimizes conductor usage, and simplifies power distribution – while improving energy-conversion efficiency and system safety. It also supports multiple future generations of NVIDIA Infrastructure platforms platforms, providing a reliable, efficient, and sustainable power foundation to meet the demands of next-generation AI computing. In addition, Foxconn’s subsidiary Ingrasys Technology also showcased a lineup of next-generation AI solutions, including NVIDIA GB300 NVL72, NVIDIA HGX B300 platform, and the new NVIDIA MGX servers designed for enterprise-grade AI applications. These innovations highlight Foxconn’s strong capabilities in AI infrastructure development, and system integration. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

Kathy Yang among those setting Asia’s agenda and shaping its future9 October 2025, Taipei, Taiwan – Joining a prestigious group identified for their innovative strategies and leadership in shaping Asia’s business landscape, rotating CEO Kathy Yang of Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has been recognized in Most Powerful Women Asia 2025 by Fortune. Taking No 5 spot in a list of 100 women executives, the distinction for the 18-year veteran of the world’s largest electronics manufacturer and technology solutions provider highlights Foxconn’s sustainable leadership progress and recognizes the expertise Yang brings with her breadth of experience in global logistics, trade compliance and worldwide campus operation oversight. The rotating CEO is part of Foxconn’s talent cultivation of a pool of leaders with proven expertise in both operational execution and organizational management. Yang, the first woman to assume the role, levels up the Group’s corporate governance work and optimization of its business and management processes. “In an era of dramatic changes in the global supply chain, building resilient operations to serve world-class customers and leveraging technology to empower teams are keys to a company's continued growth and impact. This honor also speaks volumes about all our colleagues at Foxconn,” said Yang. “We will continue to invest in talent, especially the next generation of women leaders, to collaborate toward a better future." “MPW Asia 2025 celebrates diversity – from the region’s most powerful boardrooms to the arenas of culture, sport, and public life, our honorees are setting Asia’s agenda and shaping its future,” said Ms. Ang Khoon Fong, Fortune Asia CEO. “Together, they personify the depth, range, and creativity that define the Most Powerful and Influential Women in Asia today.” The definitive list of leading women are transforming business across Asia’s major financial, consumer, and technology centers, as well as the transport, aviation, industrial and energy sectors — where scale, digitalization, and supply‐chain resilience define competitive advantage. In compiling the list, Fortune editors evaluated company scale and health; career momentum; influence; innovation; and efforts to drive social impact. Among the honorees, from 14 Asian markets, Yang is one of 28 who hold global or regional roles at Fortune Global 500 companies. About Fortune here. About Foxconn here.

Foxconn is an equal opportunity employer and we don’t stand for discrimination. The health and safety of our employees is our top priority.For the past two years, Foxconn has proactively undergone independent, third-party audits under the Responsible Business Alliance Validated Assessment Program (RBA VAP), demonstrating our commitment to critical compliance and transparency in social and environmental responsibility. Audit areas cover labor rights, occupational health and safety, environment, ethics and supply chain management. We publish the results and no priority findings were found in these audits.We welcome constructive dialogue with all stakeholders and are ready to share our improvement measures and progress. We’re open to external scrutiny to ensure our commitments are effectively met.

No 1 ‘Most Honored Company’ in Technology Hardware, ex-Japan & China23 September 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has been recognized as Asia’s No 1 “Most Honored Company” in Technology Hardware, outside of Japan and China, by Extel, a trusted leader in proprietary benchmark research and rankings formerly known as Institutional Investor.The world’s largest electronics manufacturer and technology service provider, in the 2025 Extel awards celebrating Asia Equities, also swept up top honors in its categories, including Best CEO for Foxconn Chairman and Chief Executive Officer Young Liu and Best CFO for Chief Financial Officer David Huang.Across award categories, ex-Japan and China, Foxconn was also honored for: ·      Best Company Board ·      Best ESG Program ·      Best IR Program ·      Best IR Team ·      Best IR Professional – Kristen FangThe results make it the biggest winner this year from Taiwan, demonstrating consistent recognition from global capital markets of the Group’s strong Asia Executive Team.“This recognition from international institutional investors not only highlights Foxconn’s global competitiveness but also validates our efforts in investor relations and sustainable development,” said Chairman Liu. “We will share, collaborate and thrive in our work to uphold IR best practices and collectively elevate Taiwan’s overall IR professionalism.”Foxconn CFO Huang said: “Capital investments that propel the Group’s ‘3+3+3’ strategic areas of growth, are done in hand with strict financial discipline to ensure optimal capital allocation, balancing operational and financial risks with the ultimate goal of maximizing shareholder returns.”Foxconn Spokesperson James Wu said: “We have enhanced external investor services, while also strengthening IR’s role in internal information integration and strategic advisory by adopting AI and other advanced technologies. The ‘Most Honored Company’ distinction and seven 1st-place rankings from Extel represent the highest level of recognition from global institutional investors for Foxconn’s management team, reflecting our dedication and professionalism.”The bellwether awards from Extel are the result of surveys this year that invited 5,400 buy-side fund managers and over 800 sell-side analysts to participate, making it one of the most influential and prestigious evaluations in the capital markets. Over the years, Extel’s rigorous selection process has given winners a globally recognized honor. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

Taipei, September 17, 2025 – Foxconn Interconnect Technology (FIT Hon Teng, 6088.HK), a subsidiary of Hon Hai Technology Group, today hosted its inaugural FIT Tech Day 2025 in Taipei. In the opening remarks, FIT Chairman Sidney Lu emphasized that “data and power” will be the twin foundations of AI mobility. “Everyone has heard the phrase ‘Data is the New Oil,’ but in the age of AI, oil fields alone are not enough. You must also have pipelines and energy conversion to drive the future,” said Lu. “This is precisely where FIT plays a role. Connectors and high-speed cables act as the nerves, transmitting signals and data, while power systems serve as the lifeblood, providing the sustained and efficient energy required for massive AI computing power.” Lu highlighted that AI is redefining the future landscape of mobility, and the establishment of One Mobility builds on FIT’s acquisition of German brands Autokabel and Voltaira, with a strong focus on high-efficiency power systems and integration expertise. Together with global partners, FIT aims to drive the next generation of mobility ecosystems, opening new market opportunities and cross-industry collaborations. The event also welcomed HH Prince Fahad bin Nawaf Al Saud of Saudi Arabia, who addressed the audience in his role as CEO of FIT’s Saudi joint venture Smart Mobility. Echoing the vision of “Data is the New Oil,” Prince Fahad noted that since HRH Crown Prince Mohammed bin Salman launched Vision 2030 in 2016, Saudi Arabia has made significant reforms and progress, with AI hardware and software development becoming fundamental pillars of national advancement. Since the joint venture agreement was signed last October, Smart Mobility was officially launched in May this year. Within just a few months, it has already completed three SASO product certifications and is preparing for the groundbreaking of a new factory at the end of the year, marking FIT’s first manufacturing base in the Middle East. Prince Fahad’s presence at the event not only underscores his strong support for FIT, but also reflects the firm commitment of both parties to advance technology development and co-create the future. About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Asia. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, Mobility, and Audio, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com

Munich, Taipei, Sep. 2, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will unveil its latest automotive electronics solutions at IAA Mobility 2025, Europe’s largest automotive trade fair, from September 9 to 12. Embodying its commitment to “Driving the Future of Smart Mobility,” FIH will feature its advanced High-Performance Computing (HPC) platform, Advanced Driver Assistance Systems (ADAS), and Telematics Control Units (TCU). These solutions exemplify the company’s core strengths in technological innovation and seamless integration.“The global automotive industry is rapidly electrifying, demanding a shift from mechanical-driven to electronics- and electrically driven design," FIH Vice President Dr. Wen Kuo commented. "With over two decades of experience in wireless communication and IoT product design, manufacturing, and integration, FIH helps traditional automakers accelerate this transition. Our automotive electronics solutions and comprehensive one-stop services enable faster product adoption and seamless system integration—empowering clients to lead in the era of smart mobility.”   FIH is showcasing its evolved HPC flagship product at IAA Mobility 2025, responding to the increasing demands on frequent software feature updates and the need for functionality enhancement by rapid iterations in the automotive sector. The product integrates In-Vehicle Infotainment (IVI) and Advanced Driver Assistance Systems (ADAS), together with the advanced design of the Zone Control Unit (ZCU) and Electrical/Electronic Architecture (E/EA) to enable software upgrades for all vehicle components — overcoming the current limitation where updates are usually confined to just a few key parts. Through such an innovative design, the computing power and memory are centralized and hence able to support real-time over-the-air (OTA) software updates to all vehicle components, delivering the true next-generation Software-Defined Vehicle (SDV) solution.   FIH will also present two TCU solutions: an e-Call certified 4G version currently supplied to a globally renowned automotive manufacturer, and a 5G version designed for seamless cloud integration, enabling real-time data exchange and remote diagnostics. Both TCUs have achieved key industry certifications, including IATF 16949 and ASPICE, as well as safety and cybersecurity standards such as ISO 26262, UN ECE R155 for cybersecurity, and UN ECE R156 for OTA software updates.   Building on its global footprint and agile production, FIH continues to strengthen its core automotive electronics business alongside smart manufacturing and manufacturing equipment/robotics, delivering exceptional value to customers worldwide.   Visit FIH at Booth A13, Hall B3, at the Trade Fair Center Messe München.FIH’s self-developed HPC platform, ADAS, and TCU will be exhibited at IAA Mobility 2025.IAA Mobility 2025 FIH Exhibition Information: l   Dates: September 9 to September 12, 2025 (Tuesday to Friday) l   Location: Trade Fair Center Messe München, Germany l   Booth Number: Hall B3.A13