⚫️A total of 40m axle sets globally produced since 1994 ⚫️A total of 7.9m axle sets produced in China since 2003 ⚫️Shenyang Tiexi Plant will be put into use in 2025 ⚫️Continuous growth prospects through strong order intake and outsourcing trend ⚫️Global sales increase expected from actual US Dollar 4.4 bn (Euro 4bn) to 8.8 bn (Euro 8bn) in 2029 29.08.2024 Osnabrueck # The global automotive supplier ZF Foxconn Chassis Modules (ZFFCN) expects to double its annual sales from actual US Dollar 4.4bn to US Dollar 8.8bn until 2029. Contrary to the situational decline in the global automotive market, ZFFCN is benefiting from a strong order intake of top tier OEM also for its China-based plants and ongoing outsourcing trends. Now, Tiexi plant will put into use in 2025 for additional volume production. Meanwhile, ZFFCN celebrates 30 years of chassis modules excellence in all its 25 international locations. Today ZFFCN looks back on 30 years of axle modules assembly. The supplier legacy of the 50-50 joint venture between ZF Friedrichshafen AG and Foxconn (Hon Hai Technology Group) traces back to August 1994, when the first axle sets left the plant in Duncan (USA) towards customer BMW. Since then, the customer proximity, logistics, and assembly expertise are valued through long-lasting partnerships with the world’s leading OEM such as BMW, Mercedes-Benz, Stellantis, and Jaguar Land Rover. Eike Dorff, CEO of ZF Foxconn Chassis Modules explains:“Today we have two good reasons to celebrate. Firstly, for thirty years our valued teams around the world have proven that our chassis modules expertise is market-leading. Experience, adaptability, unconditional customer focus, and passion remain our guarantors for the client’s success. We are very grateful for our customers, partners, and shareholders for their trust in us. And secondly, Iam very content, that our recent strong order intake leads to long-term business growth for our Chinese business and attracts new customers.” Dr. Xu Jun, ZF Foxconn Chassis Modules China Vice President adds: “Celebrating 30 years of chassis modules excellence overall and 21 years of successful axle systems business in China, is a remarkable testament to the loyalty of our customers and the hard work of our team. I am really happy to celebrate this achievement today and feel grateful for all partners accompanying our success story in China. With great pride and excitement our team is looking forward to several new contracts and the erection of a brand-new plant in China.” Growth perspective in China: New plant in Tiexi district and new car models Additionally to the 2 existing axle module production for 11 different car models from 2 top tier OEM in Shenyang and Beijing plants, ZFFCN will start the production of front and rear axle sets for a new platform in 2026 at Beijing plant. Furthermore, the existing ZFFCN Shenyang plant is expected to start production of an additional, completely new vehicle platform by the year 2028 in a larger volume. Meanwhile the new plant in Tiexi District will start operations in 2025 for additional volume production. Business Excellence for renown and disruptive customers With an unparalleled quality management, agile JIT/JIS processes, and a technology-open approach, ZFFCN plans to evolve its region’s services to attract new customers especially from China’s vast New Electric Vehicle (NEV) portfolio. ZFFCN’s Taiwanese shareholder Foxconn provides additional market proximity and technology know-how throughout the whole AP region. Technology-open approach ZFFCN strives to be at the fore front of the automotive industry, leveraging its expertise in logistics, operations, industrialization, and engineering to deliver added value to a variety of different customers. Many years of portfolio experience and adaptability enable ZFFCN to support its customers globally in a technology-open manner offering services for Combustion Engine (ICE), Hybrid or Fully Electric/ Battery Electric (BEV) vehicles. Visual: ZFFCN_PI_Chassis Modules Production_Logistics   About ZF Foxconn ZF Foxconn Chassis Modules is a 50-50 joint venture between ZF Friedrichshafen AG and Foxconn (Hon Hai Technology Group), founded in 2024. With its 25 locations and 3,600 employees worldwide, the actual company stems from a former ZF product line and therefore can draw on 30 years of experience in the field of axle system assembly in a Just in Time/Just in Sequence (JIT/JIS) environment. ZFFCN ensures a global tailor-made full- service approach for the automotive industry by committing to agile project management and close customer proximity. The joint venture provides industrialization, supply chain management, supplier development, and highly integrated assembly operations on global level. For more information about the ZF Foxconn: Corporate website: Home - ZF Foxconn (zffcn.com)

Frankfurt, Taipei, Sep. 5, 2024 -- FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will participate in the world's leading trade fair for the automotive service industry- Automechanika Frankfurt (AMF) 2024 from September 10 to September 14. FIH will unveil its automotive electronic solutions including 4G and 5G Telematics Control Units (TCU), In-Vehicle Infotainment (IVI) system, Smart Cockpit, Advanced Driver Assistance System (ADAS), Zonal Control Unit (ZCU), Power Distribution Center (PDC). As a leading company in the Information and Communications Technology (ICT) industry, FIH has been specially invited to deliver a keynote speech at the "Innovation4Mobility" forum this year. FIH Vice President Dr. Wen Kuo will share how, in the wave of Software-Defined Vehicle (SDV), the ecosystem and supply chain landscape of the traditional automotive industry will be fundamentally transformed, much like how smartphones overturned the entire mobile phones industry. Additionally, he will elaborate on how FIH can rapidly enter the automotive market and successfully apply this expertise to the automotive ecosystem by leveraging years of development and hardware-software integration experience in the ICT field. Dr. Kuo indicates: "Our extensive automotive electronic products exhibited this time integrate core technologies such as wireless communication, cybersecurity, over-the-air (OTA) updates, computing, sensing, in-vehicle information, human-machine interface, and cloud services. This demonstrates FIH's independent design and high-quality manufacturing capabilities in automotive electronic solutions. In the new era of SDV, we see boundless opportunities and endless possibilities for the integration of ICT and the traditional automotive industry. In the future, we look forward to having more in-depth cooperation with global partners to jointly promote the intelligent and electric transformation of the automotive industry." In addition, FIH has also been invited to speak at the "AMF Taiwan Pavilion". Danny Huang, Business Director of FIH's Mobile Vehicle Solution Business Unit, explains: "Taiwan has long played an indispensable and important role in the global electronics industry chain. At this critical time when the automotive industry and its supply chain are undergoing transformation, FIH will not only showcase our technological advantages through this sharing but also explore cooperation opportunities through experience exchange, working hand in hand with Taiwanese manufacturers to explore international markets." In recent years, FIH has actively developed a "2+2" strategy, focusing on emerging industries and technologies such as "automotive electronics, robotics, artificial intelligence, and next-generation communications". In the field of automotive electronics, FIH has quickly entered the market with its excellent communication technology strength and hardware-software integration capabilities. FIH has automotive product production lines with sufficient capacity in multiple countries including Vietnam, Mexico, India, and China. Through global footprint and flexible production strategies, FIH can make real-time dynamic adjustments according to customer needs, meeting the demands of different markets and creating the most competitive automotive electronic solutions for customers. Welcome to visit us at Hall 4.1 E58 at the Frankfurt Exhibition Center in Germany. 2024 Automechanika Frankfurt https://automechanika.messefrankfurt.com/frankfurt/en.html FIH Exhibition Information: ⚫️Dates: September 10 to September 14, 2024 (Tuesday to Saturday) ⚫️Location: Frankfurt Exhibition Center, Germany ⚫️Booth Number: Hall 4.1 E58 FIH Keynote Information: ⚫️Keynote Topic: Over-the-Air Updates: Upgrading and Monitoring Your Vehicle with Technology Borrowed from Smartphones for Smart Cars ⚫️ Time: September 12, 2024, 2:30 PM to 3:00 PM local time (UTC/GMT +2) ⚫️ Location: Frankfurt Exhibition Center, Hall 3   About FIH Mobile Limited FIH Mobile Limited was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Stock Code: 2038.HK). As a subsidiary of Hon Hai Technology Group (Foxconn), FIH Mobile Limited is a leading manufacturer in the global mobile device industry, with over 20 years of experience in integrated hardware and software design and manufacturing across diverse fields such as mobile phones, tablets, smart wearables, smart speakers, and other wireless communication devices and consumer electronics products. In recent years, FIH has been actively developing its “2+2” strategy, leveraging its core capabilities in hardware and software to expand into fields such as automotive electronics, robotics, artificial intelligence, and next-generation communication technologies, achieving significant progress and results. For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

“Hon Hai Sustainable Monitoring Platform” embodies innovative spirit at Group’s 50-year mark 2 September 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its proprietary platform that can intelligently track sustainability progress at the world’s largest electronics manufacturing service provider has won a Red Dot Award, one of the biggest creative competitions in the world. The “Hon Hai Sustainable Monitoring Platform”, which received a Red Dot Award: Brands & Communication Design, became operational in late 2023 with a user-friendly and compelling interface that belie the complex proprietary technology used to build it. It is instrumental in providing real-time snapshots of how Foxconn is tracking on a company-wide basis against its green goals that align to UN SDGs commitments. The origins of the Red Dot Design Award date back to 1955. Its distinction, the Red Dot, is established internationally as one of the most sought-after quality marks for good design. From products, brand communication and creative projects to design concepts and prototypes, the Red Dot Award documents the most prominent trends worldwide.  “Being recognized with a Red Dot is a fitting milestone for Foxconn on our 50th anniversary this year. We are innovating with information technology capabilities to do our sustainability work better,” Foxconn Vice President and Spokesperson James Wu said. The Star Wars-like, at-a-glance dashboard design of the “Hon Hai Sustainable Monitoring Platform” emphasizes user experience, utilizing dynamic simulation effects and vivid imagery to translate complex ESG data into clear and understandable graphical representations. This greatly enhances the readability and attractiveness of the information, facilitating the understanding and application of data, making it an important support tool for internal corporate decision-making. The custom-made, secure platform can intelligently aggregate data from Foxconn's 205 locations across 24 countries, enabling management to track the real-time progress of ESG goals in each region. Through intelligent analysis, it provides deep insights into each unit's ESG performance and offers timely support to ensure the achievement of ESG objectives. About Red Dot Award: Brands & Communication Design here. 

Sustainability, operational efficiency, first of its kind 17 August 2024, Taipei, Taiwan, and Chennai, India – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and the state government of Tamil Nadu in India today inaugurated a new residential complex in Vallam Vadagal Industrial Park, providing a sustainable living community for thousands of employees of the world’s largest manufacturing service provider.   The complex, built by the State Industries Promotion Corporation of Tamil Nadu (SIPCOT), is a first of its kind, reflecting active efforts by the local government to attract foreign investment, while meeting investor needs for sustainability and operational efficiency. The Vallam Vadagal residential complex represents Foxconn’s commitment to the health and safety of employees and enables a greater workforce diversity. The women-only residential complex offers peace of mind for employees living away from home and a shorter work commute. “Here, will be home to thousands of women, who will find a job with Foxconn. They will come from many regions in India, from all walks of life, at different stages in their lives,” said Foxconn Chairman Young Liu during the inauguration ceremony held at Vallam Vadagal Industrial Park. “This residential complex is now an important part of Foxconn in Tamil Nadu. It joins our commitment to sustainability in India.” Foxconn’s largest footprint in India is in Tamil Nadu. The new complex reflects the Indian state’s robust economic strategy to be a benchmark for India’s technology industry. The multi-building residential complex, which is 20 minutes from Foxconn’s mega manufacturing site via company shuttle, includes laundromat, gym, recreational areas, cafeteria and dining hall. It is the first industrial housing complex built by SIPCOT within an industrial park. The housing complex will increase Foxconn’s operational efficiency and be managed in line with the Group’s international standards and best practice.   Sustainability highlights for Foxconn’s overall India operations: Validated for Zero Waste To Landfill at Platinum-level UL2799 Constructing zero liquid discharge (ZLD) sewage treatment plant Designed series of energy-saving equipment, saving at least 40% power consumption compared with a traditional plant Constructed rain harvesting system able to store more than 2,000 KL of rainwater Third-party audits completed end-2023 under ERSA 3.0 electronics industry standard: No major risks found [link] About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises.To learn more, visit www.honhai.com

25 campuses worldwide detailed in Zero Waste To Landfill 15 August 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today issued its "Environmental Management Manual" for the first time, including mapping out 27 locations in Asia, Europe and the Americas where the Group generates zero waste, demonstrating the progress and integrity in sustainable development from the world’s largest electronics manufacturer. The latest campus to receive the science-based UL2799 validation for Zero Waste to Landfill at the platinum, or highest, level, is the Yantai campus in China. With its 100% diversion, including 6% waste to energy, the achievement of the Yantai campus means the Group has achieved UL2799 validations in five more locations since 2022, ahead of schedule. The UL2799 is an internationally-recognized standard that helps promote pollution reduction and environment protection. Foxconn now has 24 locations recognized at the platinum level, plus 3 at the gold level. With the publication of the “Environmental Management Manual”, Foxconn highlights how clear environmental management policies and procedures enable better identification, assessment, and management of environmental risks. It strengthens the Group’s compliance and competitiveness. As the Group actively makes progress toward its comprehensive zero waste park goal, it is sharing and extending experiences from its largest factories in China to other locations, including Mexico, Brazil, Vietnam, India and the Czech Republic, via internal exchanges and training. Through projects such as reducing raw material usage at the source and increasing the recycling of internal and external packaging materials, Foxconn has gradually reduced incineration and landfill waste to achieve a waste conversion rate of 100%, with incineration heat recovery not exceeding 10%. Foxconn emphasizes end-of-life waste control, employing a proprietary management system for real-time tracking and conducting regular audits of external waste processors to ensure legal waste handling. As of July 2024, the Group’s UL2799 validations cover a total of 47 companies including those with core subsidiaries Foxconn Industrial Internet (Fii), Foxconn Interconnect Technology Ltd (FIT) and FIH Mobile Ltd.  Caption: Hon Hai Technology Group (Foxconn) Zero Waste To Landfill certificate map marks the locations of the 24 platinum-level and 3 gold-level UL2799 around the world. Below is the list of legal entities holding certificates: China Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. FuDing Precision Component (Shenzhen) Co., Ltd. Foxconn Electrical Industry Development (Kunshan) Co., Ltd. Hengyang Futaihong Precision Industrial Co., Ltd Triple Win Technology (Shenzhen) Co., Ltd Shenzhien Fulian Jingjiang Technology Co., Ltd. Interface Optoelectronics (SZ) Co., Ltd Ur Materials Industry (ShenZhen) Co., Ltd Fulian Yuzhan Technology (Shenzhen) Co., Ltd Shenzhen Fulian Fugui Precision Industry Co., Ltd Shenzhen Futaihong Precision Industry Co., Ltd Futaihua Industry (Shenzhen) Co., Ltd Futaihua Industry (Shenzhen) Co., Ltd. - Longhua Branch Foxconn Technology Group Co., Ltd. Hong Zhun Precision Tooling (ShenZhen) Co., Ltd. Shenzhen Fertile Plan International Logistics Co., Ltd. Ur Hongxin Testing Technology (ShenZhen) Co., Ltd. Nanning Fulian Fugui Precision Industry Co., Ltd. Nanning Futaihong Precision Industry Co., Ltd. Fu Yu Electronical Technology (Huai An) Co. Ltd. Fulian Precision Electronics (Tianjin) Co., Ltd. Fulian Cloud Computing (Tianjin) Co., Ltd. Shenzhen Fertile Plan International Logistics Co., Ltd. (Tianjin Branch) Fulian Presision Electronics (Zhengzhou) Co., Ltd. Foxconn technology group, Futaihua Precision Industry (Weihai) Co., Ltd. Fulian Technology (Shanxi) Co., Ltd. Hong Fu Jin Precision Industry (ChongQing) Co., Ltd. Foxconn Precision Electronics (Tai Yuan) Co., Ltd. Hongtujin Precision Electronics (Zhengzhou) Co., Ltd. FIH Precision Electronics (LangFang) CO., LTD. Henan Fuchi Technology Co., Ltd. Fu Tai Hua Industry (Shenzhen) Co., Ltd. Fulian Yuzhan Technology (Henan) Co., Ltd. Hong Fu Tai Precision Electrons (Yantai) Co., Ltd. Hong Fu Jin Precision Electrons (Yantai) Co., Ltd. Futaijing Precision Electronics (Yantai) Co., Ltd. Taiwan Hon Hai Global Headquarters (Hon Hai Precision Industry Co. Ltd. Factory 3) India Foxconn Hon-Hai Technology India Mega Development Private Ltd. Competition Team Technology India Pvt. Ltd. Vietnam Fuhong Precision Component (Bac Giang) Co., Ltd. (Quang Chau P Zone) Funing Precision Component Co., Ltd. Fuhong Precision Component (Bac Giang) Co., Ltd. (Dong Vang site) Americas Foxconn Brasil Industria e Comércio LTDA FIH Mexico Industry S.A. de C.V. Europe Foxconn CZ s.r.o Foxconn European Manufacturing Services s.r.o JUSDA Europe s.r.o.   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

－Record 2Q high net profit, 1H margins improve across the board －AI server revenue surges over 60% in 2Q, strong demand ahead －3Q overall growth outlook seen higher on-quarter and on-year －Growth trend to be maintained in 4Q, visibility for full year is better   14 August 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its second quarter 2024 financial results. Revenue in the April-June period hit NT$1.55 trillion, reaching a record high for the period. Operating profit and net profit were both also record highs for the second quarter. Earnings per share in the second quarter was NT$2.53. Looking forward to the third quarter, which has entered the traditional peak season, operations are expected to warm up. Overall, there will be significant growth in the July-September quarter both on-quarter and on-year. For the full-year 2024, thanks to strong demand for AI servers, the outlook for significant growth is unchanged, but with better visibility. In the second quarter, revenue rose 19% from a year ago to NT$1.55 trillion; gross profit was up 19% as well, to NT$99.5 billion; operating profit surged 44% to NT$44.6 billion; and net profit (attributable to the owners of the parent company) at NT$35 billion, increased 6%. Gross profit margin, operating profit margin and net profit margin were 6.42%, 2.88% and 2.26% respectively, compared with 6.41%, 2.37% and 2.53% from the same period last year. EPS reached NT$2.53 in the second quarter, up from NT$2.38 a year ago, growing NT$0.15. Foxconn Chief Financial Officer David Huang said second quarter’s profit margins on a gross and operating basis improved compared to a year ago. Gross profit margin improved to 6.42% mainly due to product mix optimization and revenue increase. Net profit rose 6% from a year ago to NT$35 billion, a record high for the second quarter, resulting in an EPS of NT$2.53, up NT$0.15 at the same time. For the first half of the year, revenue reached NT$2.875 trillion, up 4% from a year earlier. For the January-June period, gross profit at NT$183.2 billion, rose 7%; operating profit was up 14% to NT$81.4 billion; and net profit (attributable to the owners of the parent company) grew 25% to NT$57.1 billion. Gross profit margin, operating profit margin and net profit margin were 6.37%, 2.83% and 1.98%, respectively, with all three indicators showing improvement compared with 6.21%, 2.58% and 1.66% in the same period last year. EPS reached NT$4.12, compared with the same period last year of NT$3.31, an increase of NT$0.81. Looking ahead at the third quarter, operations will gradually ramp up entering the traditional peak season. Third quarter will see significant growth, both quarter-on-quarter and year-on- year, and the growth trend will be maintained for the fourth quarter, said Foxconn Vice President and Spokesperson James Wu. Among the Group's four primary product segments, Wu said strong sequential growth is expected in the third quarter for smart consumer electronics, where new product preparations are underway; cloud and networking products will turn in significant growth, when compared to the previous quarter and the same period a year ago, thanks to ongoing revenue momentum in AI servers; and computing products should decline slightly due to a high base period, but still see significant growth year-on-year. Finally, strong growth, on-quarter and on-year, is expected for components and other products, where shipments of components related to the core business have increased, including connectors, precision components, lens modules, and automotive products. Looking into the progress of the customer AI segment, Wu said strong customer demand drove AI server revenue in the second quarter up more than 60% on-quarter, and accounted for more than 40% of overall server revenue for the period. Foxconn combines cloud and networking competencies to become the only supplier with comprehensive AI supply chain vertical integration capabilities that can provide customers with complete solutions. Wu said strong demand for AI servers is expected to continue. We maintain our view that AI servers will contribute to 40% of overall server revenue this year; at the same time, strong demand for new-generation AI rack solutions from different types of customers that we have seen should make a significant contribution to Foxconn's server revenue in 2025. AI servers should soon become Foxconn’s next trillion-dollar revenue product. Wu said the latest market conditions indicate revenue growth of AI servers this year is still quite strong, and the existing H series products have good visibility. The outlook for sequential quarterly growth this year in AI server revenue remains unchanged. The development schedule of the GB200 rack is on track. Foxconn will definitely be the first supplier to deliver and shipments should begin in the fourth quarter. If the schedule remains unchanged, the performance of the entire AI server segment may be better than originally estimated. Development of the Group’s three major platforms based on generative AI – Smart Manufacturing, Smart EV, and Smart City – is moving forward. In smart manufacturing, Wu said the Group is carrying out different-oriented projects with multiple partners simultaneously. This includes introducing GenAI into production processes, building "robot+AI" platforms to improve automation capabilities, and creating a new generation of digital factories. Regarding smart city, the Group continues to promote comprehensive city-wide solutions services and is currently discussing the establishment of smart city application proof of concept (PoC) with key cities in Mexico. Closer to home, the Group is assisting passenger transport operators in integrating legacy platforms and applications, and supporting the Kaohsiung City Government in upgrading the bus service system, as part of Foxconn’s CityGPT platform solutions. In smart electric vehicles, more than 5,400 units of the MODEL C by Foxconn subsidiary Foxtron Vehicle Technologies have been delivered through July. Since April, the monthly delivery volume has been steady at more than 1,000 units. Regarding the progress on overseas customers, two traditional Japanese automotive customers and three projects are expected to complete contract signing in the second half of this year. Turning to semiconductors, Wu said the Group continues to improve the production capacity of the SiC supply chain. Mass production has started on 1,200V MOSFET. At the same time, installation of upstream epitaxy equipment is done and should lead to better capabilities over technology and costs. Downstream, equipment is being installed in module factories one after another and trial production is expected to start in the third quarter. The specification development of the ADAS SoC chip has been completed in the large IC area. At the same time, relevant functional tests for ADAS target scenarios are being conducted on the chip's software platform. During the investor call, Foxconn unveiled the first details of its flagship annual technology conference, Hon Hai Tech Day 2024, which will take place over two days on October 8-9. Following the success of last year’s VIP keynotes – from the CEOs of semiconductor powerhouse NVIDIA and German automotive chassis giant ZF – which was the first time any external partner or customer took to the HHTD stage, the event this year will be packed with even more compelling technology talks and exhibitions.

29 July 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world's largest electronics manufacturer, and Extreme Tech Challenge (XTC), the world's largest innovation ecosystem for founders tackling global challenges, announce their partnership, set to invigorate the tech-for-purpose space. Foxconn's involvement in this partnership marks a significant milestone in advancing global innovation for sustainability and environmental impact. At the heart of this collaboration is the Extreme Tech Challenge Semi & AI for Climate Startup Cup. This pioneering competition is scheduled to launch this summer, with its semifinals to be held during TechCrunch Disrupt on October 30, 2024. The event will feature a full pitch program and exclusive VIP networking reception, fostering invaluable connections between visionary startups and industry leaders. The finals round will be held at CES on January 7, 2025. “We are incredibly excited to partner with Foxconn to launch the Semi & AI for Climate Startup Cup,” said Young Sohn, Chairman of the Samsung Semiconductor Advisory Board, Founding Managing Partner at Walden Catalyst Ventures, and Co-founder of Extreme Tech Challenge. “This partnership represents a significant step forward in our mission to harness the power of technology to address the urgent challenge of climate change. With Foxconn's manufacturing expertise and XTC’s global network, we offer visionary founders the platform and jet fuel they need to scale their solutions. Together, we can make meaningful progress towards a sustainable and resilient future.” This partnership represents a powerful fusion of Foxconn's industrial expertise, visionary innovation, and commitment to environmental, social, and governance (ESG) principles. Foxconn aims to amplify its reputation as a leader in electronics manufacturing while driving green manufacturing and producing smart environmental solutions. Through this collaboration, Foxconn is set to not only support but also actively invest in the next generation of deep-tech startups. “This particular challenge aligns with what Foxconn believes in. Semiconductors and artificial intelligence are two key technologies that will help drive sustainable growth for all of us,” said Young Liu, Chairman of Hon Hai Technology Group (Foxconn). “With XTC, we are looking forward to seeing how fresh innovators take these powerful and versatile technologies to innovate for the good.” Foxconn’s dedication to integrating cutting-edge technologies with sustainable solutions aligns perfectly with XTC’s mission. By bridging the gap between visionary startups and industry leaders, Foxconn and XTC are set to ignite a wave of innovation that will drive solutions to some of the world’s most urgent challenges. The competition aims to provide startups with the infrastructure, mentorship, and global reach that only Foxconn, with its vast manufacturing and technological prowess, can offer. This partnership is a testament to what can be achieved when industry giants, ecosystem builders, and visionary startups unite with a shared purpose. This collaboration will also significantly contribute to achieving the UN Sustainable Development Goals. Together, Foxconn and XTC are poised to unlock new possibilities and drive impactful change. Partnering with XTC aligns perfectly with Foxconn's vision of leveraging technology for a better world. Through this competition, they aim to discover and support the next generation of innovators who are addressing critical global challenges. With the combined efforts of Foxconn and XTC, the future of deep-tech innovation looks brighter than ever. This collaboration promises advancements that will not only revolutionize industries but also contribute to a more sustainable world.   About Extreme Tech Challenge (XTC) Founded by legendary Silicon Valley venture capitalists Young Sohn and Bill Tai, XTC is the world’s largest platform to accelerate startups addressing the UN Sustainable Development Goals. Through its startup competitions, innovation programming and panel discussions at leading tech conferences, thought leadership and networking events, XTC provides exceptional founders the potential for global visibility, venture investment, corporate collaborations, and world-class mentorship. Since 2015, XTC finalists have raised $4.4B+ in investment capital. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 30 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. To learn more, visit www.honhai.com

Mount Pleasant, WI (July 24, 2024) – We Energies, a Wisconsin-based utility company of WEC Energy Group (NYSE: WEC), and Hon Hai Technology Group ( “Foxconn”) (TWSE:2317) announced the completion of a project to install solar panels at Foxconn’s Science and Technology Park in Mount Pleasant, Wisconsin. “In partnership and collaboration with We Energies, Foxconn is pleased with the end results of this joint effort to integrate green and sustainable practices throughout our manufacturing operations to further achieve our responsibility of protecting the environment,” said Foxconn Technology Group. “As Foxconn’s operations in Wisconsin expand in response to market demand, the presence of renewable energy resources demonstrates our commitment to environmental stewardship across the manufacturing supply chain to our customers and the community.” Foxconn has invested over $1 billion in Wisconsin and today employs over 1,000 employees who manufacture data servers and motherboards for tier-1 customers. These customers look to suppliers such as Foxconn to use renewable sources of energy throughout the manufacturing process when determining additional business growth. The one-megawatt project features nearly 2,000 solar panels capable of producing enough energy to power 300 homes. The unique project design utilizes a mix of single-axis tracking and fixed-tilt panels to maximize the renewable energy production capability. “We’re pleased to bring more clean energy to Wisconsin through this partnership with Foxconn,” said Mike Hooper, president — We Energies.. “As Foxconn expands its operations, this project will deliver affordable, reliable and clean energy for years to come.” The annual energy production expected from this solar project is estimated to offset more than 1,200 metric tons of carbon dioxide (CO2) emissions, equivalent to taking 260 cars off the roads or planting 20,000 trees. During the 30-year life of the system and the agreement between We Energies and Foxconn, the benefits are expected to grow to well over 33,000 metric tons of CO2 removed, 7,200 cars off the road, or 560,000 trees planted. ABOUT WEC ENERGY GROUP WEC Energy Group (NYSE: WEC), based in Milwaukee, is one of the nation’s premier energy companies, serving 4.7 million customers in Wisconsin, Illinois, Michigan and Minnesota. The company’s principal utilities are We Energies, Wisconsin Public Service, Peoples Gas, North Shore Gas, Michigan Gas Utilities, Minnesota Energy Resources and Upper Michigan Energy Resources. Another major subsidiary, We Power, designs, builds and owns electric generating plants. In addition, WEC Infrastructure LLC owns a growing fleet of renewable generation facilities in states ranging from South Dakota to Texas. WEC Energy Group (wecenergygroup.com) is a Fortune 500 company and a component of the S&P 500. The company has approximately 35,000 stockholders of record, 7,000 employees and more than $43 billion of assets.   ABOUT FOXCONN TECHNOLOGY GROUP Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (2317: Taiwan) is the world’s largest electronics manufacturer. Hon Hai is also the leading technological solution provider, and it continuously leverages its expertise in software and hardware to integrate its unique manufacturing systems with emerging technologies. Hon Hai has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – new-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. In addition to maximizing value-creation for customers who include many of the world’s leading technology companies, Hon Hai is also dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. www.honhai.com.