Universal scene description technologies to support advanced 3D industrial applications20 November 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its membership into the Alliance for OpenUSD, supporting the 3D ecosystem in promoting global collaboration for universal scene description.AOUSD, launched in August 2023, is establishing OpenUSD as an international, cross-industry standard with written specifications as part of the new roadmap that will enable greater compatibility and wider adoption, integration, and implementation. Created by Pixar, OpenUSD is a high-performance 3D scene description technology that offers robust interoperability across tools, data, and workflows.“Foxconn’s manufacturing excellence is increasingly incorporating technologies using artificial intelligence and digital twins, requiring 3D industrial applications,” said Dr. Zhe Shi, Foxconn’s Chief Digital Officer and head of its Smart Manufacturing platform. “By partnering with AOUSD, Foxconn can participate in the research and development of related software technologies of our partners and promote the spirit of open source sharing.”AOUSD was founded by Pixar, Adobe, Apple, Autodesk, and NVIDIA, together with the Joint Development Foundation (JDF), an affiliate of the Linux Foundation, and now includes software and hardware bellwethers all aligned to promote the standardization, development, evolution, and growth of Pixar’s Universal Scene Description technology.The AOUSD membership reinforces Foxconn’s commitment to open source and innovation. Foxconn joined the Open Invention Network earlier this year and remains among the Top 100 Global Innovators named by Clarivate. About AOUSDThe Alliance for OpenUSD (AOUSD) is an open organization dedicated to fostering the interoperability of 3D content through OpenUSD (Universal Scene Description) to enable developers and content creators to more easily describe, compose, and simulate large-scale 3D projects. The Alliance brings together a diverse and inclusive community to provide an open forum for collaborative development and discussion around the standardization, development, and growth of OpenUSD.About FoxconnEstablished in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises.To learn more, visit www.honhai.com

Companies Showcase Implementation at Taiwan and Mexico Plants19 November 2024, Taipei–Foxconn announced today it is collaborating with NVIDIA to build digital twins to reshape the future of manufacturing processes and supply chain management while opening new pathways for global deployment of advanced facilities and enhancing corporate resilience.This forward-looking partnership first debuted at last year's Hon Hai Tech Day (HHTD23), showcasing Foxconn’s development on the NVIDIA Omniverse platform to create a 3D digital twin to plan and simulate automated production lines at the Taiwan Hsinchu factory. Omniverse adoption at the Hsinchu factory will be scaled out to worldwide Foxconn factories. Meanwhile, advancements in the Mexico factory enable the implementation of NVIDIA Omniverse, NVIDIA Isaac for robotics, NVIDIA Modulus for AI-driven simulations, and OpenUSD for data interoperability.The core advantage of digital twin technology lies in its rapid scalability and simulating processes virtually before deploying in the real world, which has become key to Foxconn's strengthened global deployment. Through this technology, Foxconn can replicate and establish production lines across diverse geographical locations with unprecedented speed and precision. This capability enables Foxconn to swiftly deploy high-quality production facilities with unified standards in strategic markets worldwide, significantly enhancing the company's competitiveness and adaptability in the global landscape.Beyond accelerating Foxconn's global deployment, these digital twin capabilities also significantly enhance the company's resilience. When facing supply chain disruptions or sudden market demands, Foxconn can quickly simulate manufacturing process changes, and adjust production strategies to flexibly allocate resources across different regions for itself and its clients, ensuring production continuity and stability. This high degree of adaptability and flexibility allows Foxconn to maintain a strong competitive advantage in the complex and ever-changing global economic environment.About FoxconnEstablished in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking in the top 32 among the Fortune Global 500. In 2023, revenue totaled TWD6.162 trillion (approx. USD198 billion or EUR183 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates 205 campuses across 24 countries and is one of the world’s largest employers with over a million employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises.To learn more, visit www.honhai.com. 

*New highs for 3Q made in revenue, gross profit, operating profit, net profit, EPS *Maintain significant growth outlook for full year 2024, but visibility is better *Shipment volume of AI servers expected to grow quarter by quarter in 2025 *2025 seen as “AI Year” for Group, AI server market can rapidly develop --- 14 November 2024, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its third quarter 2024 financial results. Revenue reached NT$1.85 trillion, and for the cumulative January-September period revenue totaled NT$4.7 trillion, both setting new highs for the same period compared to previous years. Third quarter revenue, operating profit and net profit all hit a record high for the period. Earnings per share at NT$3.55 was also a new high for the three month period of July-September. Looking forward to the fourth quarter, which has entered the traditional peak season, operations will gradually ramp up, and there is expected to be significant quarterly and annual growth. For the full-year outlook for 2024, thanks to strong demand for AI servers, the outlook for significant growth remains unchanged, but with better visibility. Looking into 2025, Foxconn Chairman Young Liu laid out five major operating pillars: namely artificial intelligence, three major platforms (Smart Manufacturing, Smart EV, Smart City) and semiconductors. He predicted that 2025 will be the “AI Year” for the Group; at the same time, he said he is optimistic about next year, in which AI will be the most important growth driver for the Group. While inflation is likely to ease, the international political and economic situation, monetary policy and the development of the AI industry will be the most important influencing factors next year. Regarding the prospects for AI server products, Chairman Liu said that Foxconn has the capabilities of system design, vertical integration, and global footprint in this field, and will continue to maintain its leading advantage. Based on current trends, the AI server market can continue to develop rapidly in the next few years. In the July-September quarter, revenue reached NT$1.85 trillion, up 20% from a year earlier. At the same time, gross profit at NT$114.7 billion rose 12% on-year, operating profit at NT$54.8 billion climbed 19% on-year, and net profit (attributable to the owners of the parent company) at NT$49.3 billion gained 14% on-year. The quarter-on-quarter gains were 20%, 15%, 23%, and 41%, respectively, compared with the second quarter. Third quarter EPS at NT$3.55, was up NT$0.44, from NT$3.11 in the same period last year, and increased by NT$1.02 when compared to the second quarter. Five metrics including revenue, gross profit, operating profit, net profit, and EPS all set new highs for the third quarter. Chief Financial Officer David Huang said that although margins in the third quarter were affected by the product mix, due to the competitive advantage of Foxconn’s operating scale, the absolute amount of gross profit, operating profit and net profit all increased compared with the same period last year. As a technology manufacturing platform service company, Foxconn will continue to maximize profits through its competitive advantages in operational scale and vertical integration. For the first nine months of 2024, revenue at NT$4.7 trillion, was up 10% from the same period a year earlier, while at the same time, gross profit reached NT$297.9 billion, rising 8%, operating profit totaled NT$136.1 billion, gaining 16%, and net profit (attributable to the owners of the parent company) was NT$106.4 billion, climbing 20%, with the absolute amounts hitting a new high for the same period compared to previous years. EPS in the first three quarters of this year reached NT$7.67, an increase of NT$1.25, from NT$6.42 in the same period last year. External interest in Foxconn’s view toward the United States in the aftermath of the presidential election has prompted media queries on the issue. Chairman Liu responded by saying that as a multinational enterprise, the Group is not concerned about the election itself, but is looking at factors such as investment policy, environment and business opportunities. Chairman Liu emphasized that Foxconn, operating in America, has seen at least 11 presidential election cycles come and go. The Group's footprint in the United States is based on its corporate mission: long-term value creation; business sustainability; constant pursuit of improvement; innovation; and global perspective. This mission has been deeply cultivated for nearly four decades. In America, nearly 50 factories have been set up, more than 5,000 people employed, and annual revenue of USD 25.6 billion generated. Such results are thanks to efforts contributed by Foxconn colleagues in America. As for Wisconsin, over the past three years, Foxconn’s investment in the state has reached USD 1 billion and the number of employees has increased by at least 42%; revenue in Wisconsin is up by 140% compared with the same period last year. From this year, Foxconn has become the largest taxpayer in Racine County. Because of Foxconn’s efforts, we have seen more companies invest locally, contributing to Wisconsin’s economy and employment. In the long run, having the advantage of Foxconn’s global footprint and new business development opportunities, the Group's factories in Wisconsin and Texas will benefit in the fields of AI and servers; the electric vehicle factory in Ohio will continue to introduce new customers. The Group also announced new investments in the United States a few months ago, so Foxconn’s outlook in America is very positive. Looking ahead to operating performance in the fourth quarter, in addition to the traditional peak season, the well-performing smart consumer electronics product segment is expected to show strong quarter-on-quarter growth; in terms of cloud and networking products, the demand for AI servers is strong. The cumulative revenue of AI servers in the first three quarters of this year grew more than 200% compared to the same period last year, and general server revenue also grew by more than 20%. Compared with the same period last year, strong growth will be seen. Regarding full year 2024, the overall outlook for significant growth is unchanged, although the visibility is better than in August. Among the main products, the growth of cloud and networking products is even stronger, while components and other products are also performing strongly. For computing products, the full-year outlook for this segment has been raised to significant growth due to the effects of new products. Foxconn leverages its competitive advantages in AI server R&D, digital manufacturing platform, vertical integration, customer relations, and global footprint. Driven by strong customer demand, revenue in AI servers has grown more than 200% in the first three quarters, and accounted for more than 40% of overall server revenue. Coupled with the growth of general-purpose servers, the cloud and networking product segment accounts for more than 30% of the Group's revenue. Alongside strong demand for AI servers, Foxconn covers almost all segments from large cloud service providers and NCPs to top tier brand customers. In 2025, shipment volume of AI servers is expected to increase quarter by quarter, accounting for more than 50% of overall server revenue, becoming the most important driver for the company's growth. With the upcoming launch of new AI products, Foxconn will fully grasp this wave of business opportunities and enter another stage of growth. We are not only AI suppliers, but also users of AI. With the significant increase in AI computing power, we have also begun to build a super computing center and will soon become a major manufacturing factory with AI super computing capabilities. As Foxconn continues to invest in GenAI on the manufacturing side, the company’s Smart Manufacturing has increased revenue per employee by more than 80%, and, including AI, robotics, and automation, is collaborating with several major international partners. Foxconn’s achievements in smart manufacturing will be more significant in the future with the support of massive AI computing power. In terms of the Smart EV platform, Foxconn showcased MODEL U, MODEL D and MODEL A at this year’s Hon Hai Tech Day (HHTD24), making its product portfolio more comprehensive and diverse. Before the end of this year, preparations for the mass production of MODEL B should be completed. As for the Smart City platform, the company is negotiating related cooperation with customers in the Americas and Japan. The CityGPT application demonstrated at HHTD24 attracted a lot of attention at home and abroad; its development will continue to deepen. Foxconn will focus on becoming a technology manufacturing platform service company based on the foundation of its longstanding manufacturing services, plus its three major platform solutions, including Smart Manufacturing, Smart EV, and Smart City. Earlier this week, SHARP Corp issued its fiscal year second quarter results, turning a profit for the first time in five quarters with the quarterly net profit reaching a high not seen in more than two years! Sakai Display Products (SDP) also made considerable progress in transforming into an AI data center. Regarding this, Chairman Liu said the financial results demonstrate that the worst is behind SHARP. Foxconn assisted SHARP in its transformation during this period; its strategy of focusing on brand and technology has gradually shown results. Looking ahead, Chairman Liu said Foxconn will continue to support SHARP in its active transformation, allowing SHARP to focus on its own brand power and technological capabilities, combined with Foxconn’s new businesses, extensive product portfolio and global reach, to accelerate the upgrade of its overall transformation.

To ensure the Company's sustainability, the key audit includes factories in Mainland China and India. The purpose of the audit is to make sure all factories comply with ESG standards and effectively manage potential risks. Furthermore, the audit outcome is disclosed to increase the Company's operational transparency. According to the audit, there were 144 non-compliances, achieving an overall compliance rate of 90%. No significant non-compliance was found in labor rights (including forced labor), environment, corporate ethics, supply chain management and management systems. The Group has been closely monitoring the corrective actions for audit findings, achieving a 78% improvement rate for identified non-compliance as of September 2024. Monitoring efforts will continue to address the remaining issues.  

QunaSys, a leading Japanese innovator in quantum computing software, has announced a strategic partnership with Hon Hai Research Institute, a Taiwanese leader in advanced quantum technology. The collaboration will focus on integrating Hon Hai Research Institute’s advanced Fermionic Encoding methods, a technique that allows for more efficient simulation and manipulation of quantum particles, into QunaSys' quantum toolkit, QURI Parts. This partnership with the institute affiliated with Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturing service provider, aims to advance the development of quantum algorithms and enhance performance across quantum simulators and computers. The two teams will conduct research on utilizing AI technologies to improve and refine Hon Hai Research Institute’s Fermionic Encoding methods, driving forward innovation in quantum simulation. This groundbreaking research is expected to result in new methodologies and algorithms that will accelerate advancements in quantum computing. By integrating these new methods into QURI Parts, the partnership aims to make quantum simulations—especially those involving complex systems—more accurate and efficient. The upgraded toolkit will offer users powerful new features, smoothly working with other parts of QURI Parts to maximize performance across both quantum simulations and actual quantum computers. This collaboration represents a significant step forward for both QunaSys and Hon Hai  Research Institute, not only in the development of quantum software but also in the expansion of research and development capabilities. Both parties are committed to fostering innovation, sharing knowledge, and driving new discoveries that will benefit the entire quantum computing ecosystem. "This partnership underscores our commitment to pushing the boundaries of quantum coding and software,” said Tennin Yan, CEO of QunaSys. “By working closely with Hon Hai Research Institute, we are combining our strengths to unlock new possibilities and deliver cutting-edge solutions that will shape the future of quantum technology." Min-Hsiu Hsieh, Director of the Quantum Computing Research Center at the Hon Hai Research Institute, said: "Partnering with QunaSys allows us to bring our Fermionic Encoding methods to a wider audience while simultaneously pushing the boundaries of what’s possible through collaborative research on Neural Networks."   About QURI Parts QURI Parts is QunaSys' open-source library suite for creating and executing quantum algorithms on a variety of quantum computers and simulators. The library provides modular components that allow users to easily assemble their own algorithms or modify existing ones by swapping subcomponents. Once built, the algorithms can be executed on various quantum platforms without changing the core algorithm code. A standout feature of QURI Parts is its focus on computational performance, making it possible to extract maximum efficiency from quantum simulators. By offering flexibility, power, and ease of use, QURI Parts empowers developers and researchers alike to accelerate quantum innovation.

Riyadh, Saudi Arabia –Ministry of Energy has announced the formation of a groundbreaking joint venture between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology (FIT), a highly esteemed global manufacturer to support the Kingdom's Vision 2030. The partnership aims to produce Saudi-made electric vehicle (EV) charging stations, strengthening Saudi Arabia’s leadership in renewable energy and technological innovation. This partnership is endorsed by Prince Abdulaziz bin Salman Al-Saud, Minister of Energy; Mr. Bandar Alkhorayef, Minister of Industry and Mineral Resources; and Mr. Hamad Al Sheikh, a government minister, reflecting strong support from the Saudi authorities. On behalf of Saleh Suleiman Alrajhi & Sons, Next Charger, the company’s subsidiary, has accumulated highly respected experience in the local charging pile industry. The collaboration with major European brands and local distributors has contributed extensive practices which will be leveraged in the joint venture, providing valuable insights and proven strategies for success. The signing ceremony is inaugurated by HH Prince Fahad bin Nawaf Al Saud who emphasized his shared vision under the leadership of HRH the crown prince Mohammad Bin Salman. “We are committed to creating a sustainable and diverse future for the Kingdom,” Prince Fahad declared. By sharing his perspective as a forward-thinking entrepreneur and prestigious market leader, Prince Fahad envisions the joint venture as pivotal in driving the growth of electric mobility across Saudi Arabia. FIT, a subsidiary of Foxconn Technology Group, has comprehensive charging solutions evidencing its excellent design capability for power modules and top-notch manufacturing capability. “By reducing the Kingdom’s reliance on imports and fostering domestic expertise, we can boost job creation and enhance the country’s technological self-sufficiency. Partnering with FIT is a strategic step toward local manufacturing,” Said Saleh Suleiman Abdulaziz AlRajhi, Chairman of Saleh Suleiman Alrajhi & Sons. FIT has already achieved significant milestones, including the certification of its AC charger by the Saudi Standards, Metrology and Quality Organization (SASO). Their award-winning design team, recipient of the 2024 IF Design Award and Red Dot Award, will bring unparalleled customization options to the joint venture, tailoring charger designs to meet market preferences. Louie Yeh, Head of FIT’s charging pile business, commented: “Our joint venture will prioritize the development of high-quality charging stations designed for optimal performance in Saudi Arabia’s unique environmental conditions. Given the intense sunlight, our products underwent UV testing to ensure durability.” The signing ceremony also underscored the partnership’s broader impact, extending beyond technological innovation to focus on talent development for the Kingdom’s future. Mr. Andreas Cangellaris, Founding President of NEOM University, was in attendance, reuniting with Sidney Lu, Chairman & CEO of FIT. Both men share a strong connection to the University of Illinois Urbana-Champaign (UIUC), where Lu’s contributions led to the renaming of the Mechanical Engineering Building in his honor, and where Mr. Cangellaris previously served as Provost before joining NEOM. This joint venture not only represents a critical step forward for the Kingdom’s renewable energy sector but also underscores a commitment to shaping the next generation of skilled professionals. "Through this partnership, we aim to drive innovation in EV charging solutions while cultivating local talent, aligning with Vision 2030’s goals of creating a sustainable, diversified economy," the companies jointly stated. About Saleh Suleiman Alrajhi & Sons Saleh Suleiman Alrajhi & Sons, established in 2011, is a prominent and well-established family business in Saudi Arabia. Their business dates back to 1957 when the world’s first Islamic bank was established. Over the years, the family has played a significant role in the country’s economic reforms and initiatives. With a diverse portfolio spanning healthcare, construction, steel and manufacturing, and technology, Alrajhi is driving growth through strategic partnerships with global industry leaders, embracing innovative practices, and incorporating a range of perspectives to boost its competitiveness on the international stage. The company also invests in promising future technologies that align with Vision 2030.   About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com  

Hong Kong –  October 17, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: - 224G+ sockets for XPU/GPU connectivity - Co-packaged copper and optical architectures - Power cables for ORV3 - Active Optical Cables (AOC) - OSFP1600 and QSFP-DD port configurations These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions. About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com Media Contact: Email: fit-ir@fit-foxconn.com   Product and Service Inquiries: Europe and America Contact: sales-usa@fit-foxconn.com       

Imec invites the global automotive ecosystem to join its effort to mutually explore the opportunities presented by chiplet technology LEUVEN (Belgium), October 10, 2024 — Today, at an exclusive gathering in Detroit, bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP). The program brings together stakeholders from across the automotive ecosystem in a pre-competitive research effort unparalleled in the car manufacturing industry. The program’s goal is to evaluate which chiplet architectures and packaging technologies are best suited to support car manufacturers' specific high-performance computing and strict safety requirements, while striving to extend the benefits of chiplet technology – such as increased flexibility, improved performance and cost savings – to the entire automotive industry.  Car makers have been integrating chip technology into their vehicles since the late 1970s. Lately, however, traditional chip architectures have struggled to meet the requirements of ever more demanding automotive solutions, such as advanced driver assistance systems (ADAS) and immersive in-vehicle infotainment (IVI) services. Enter chiplets – i.e., modular chips that are specifically designed to perform specialized functions efficiently and can be seamlessly combined to create more sophisticated compute systems. “The adoption of chiplet technology would signal a disruptive shift in central vehicle computer design, offering distinct advantages over traditional monolithic approaches. Chiplets facilitate rapid customization and upgrades, while reducing development time and costs,” explained Bart Placklé, vice-president of automotive technologies at imec. “However, moving to a chiplet architecture is prohibitively expensive for OEMs if done in isolation. Commercial viability thus hinges on industry alignment around a set of chiplet standards, enabling car manufacturers to procure chiplets from the market and integrate them with proprietary chiplets to build unique offerings.” In search of a chiplet architecture that combines performance, energy efficiency, robustness, cost effectiveness and customization Companies developing supercomputing, data center and smartphone solutions have long explored the benefits of chiplet technology to meet their rapidly increasing computing needs. But the automotive industry has been somewhat more reluctant to embrace the chiplet paradigm due to the unique challenges they face. First, automotive solutions must meet strict robustness and reliability requirements, ensuring continuous operation and passenger safety over a car's typical lifespan of ten to fifteen years. Moreover, cost is another crucial factor to consider. And, finally, superior performance and exceptional energy efficiency are critical to preserving a car's battery life. These are some of the urgent issues imec's Automotive Chiplet Program will address.  A pre-competitive, collaborative research effort unparalleled in the automotive industry Imec’s Automotive Chiplet Program leverages imec’s world-leading track record in advanced 2.5D and 3D packaging with resources and expertise from different parts of the automotive value chain. Bart Placklé: “The agility of chiplets will allow the automotive ecosystem to respond quickly to changing market demands and technological breakthroughs. They also facilitate flexible component integration, limiting the risk of vendor lock-in and improving supply chain resilience. In addition, their optimized performance leads to lower power requirements, enabling compact device design.” “We are convinced that all stakeholders will gain important insights from the program’s pre-competitive, collaborative approach – leveraging the partners’ collective wisdom and means to make rapid progress.  The valuable precompetitive learnings from the program can be instantiated in further R&D and product innovation to accelerate the partners’ own differentiating, long-term roadmaps. In fact, this methodology mirrors the successful practices established in the semiconductor industry over the past four decades. With 40 years of experience in designing, building, and optimizing chip architectures and technologies, and without allegiance to any stakeholder in the automotive ecosystem, imec is uniquely positioned to guide the car manufacturing industry towards the development of a groundbreaking new chiplet architecture tailored to the sector’s specific needs,” he concluded.   About imec Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2023, imec's revenue (P&L) totaled 941 million euro. Further information on imec can be found at www.imec-int.com.   Imec is a registered trademark for the activities of imec International (IMEC International, a legal entity set up under Belgian law as a “stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland supported by the Dutch Government),  imec Taiwan (IMEC Taiwan Co.), imec China (IMEC Microelectronics (Shanghai) Co. Ltd.), imec India (IMEC India Private Limited), imec San Francisco (IMEC Inc.) and imec Florida (IMEC USA Nanoelectronics Design Center Inc.).