Grenoble (France) and Taipei (Taiwan) – 12 May 2026 - Quobly, a French pioneer in silicon-based quantum computing, and Taiwan’s Hon Hai Research Institute, the R&D arm of Hon Hai Technology Group (Foxconn), today announced the release of an open-source numerical toolbox, jointly developed by the two partners, dedicated to the Quantum Phase Estimation (QPE) algorithm, a cornerstone of fault-tolerant quantum computing with major applications in quantum chemistry and materials science.QPE is widely regarded as a key algorithm for computing ground-state energies of molecular systems on future fault-tolerant quantum computers. While its theoretical properties and asymptotic cost scalings are well understood, practical resource estimates and realistic performance trade-offs remain largely unexplored, due to the difficulty of simulating QPE beyond toy models.The newly released toolbox aims to bridge this gap by providing researchers with a practical environment to explore QPE implementations and their resource implications, with a strong focus on understanding algorithmic building blocks and their practical implementation constraints.From theory to practice: exploring the full QPE pipelineThe QPE Toolbox is designed to give quantum algorithm practitioners a hands-on, numerical understanding of the full QPE workflow, from chemistry preprocessing to phase estimation, in a regime that challenges classical simulation while remaining computationally tractable.Built on advanced tensor network techniques, the toolbox enables users to:• Prepare physically motivated initial states using DMRG and matrix product states,• Encode molecular Hamiltonians into quantum circuits via trotterization or block-encoding / qubitization methods,• Compare textbook QPE with single-ancilla Robust Phase Estimation (RPE),• Analyze circuit depth, gate counts, and error sources without necessarily executing the circuit.The toolbox relies on the open-source quimb library and interfaces with standard quantum chemistry tools such as PySCF, ensuring compatibility with established workflows.The first release is designed as an educational and exploratory framework, enabling researchers to build intuition around the practical implementation of QPE and its variants.A modular tool for realistic numerical experimentsRather than attempting to simulate early fault-tolerant quantum computers,ith which are by nature beyond classical reach, the QPE Toolbox focuses on practical, interpretable numerical experiments in regimes accessible to classical computation, where algorithmic choices, initialization fidelity, and Hamiltonian encoding strategies can be explored in detail.Illustrative use cases enabled by the toolbox include (non-exhaustive):• Full circuit executions for ~10–20 qubits and circuits ranging from <1,000 to ~100,000 gates,• Ground state preparation for systems up to ~20–30 qubits,• Hamiltonian encoding for systems up to ~20–30 qubits,typically within a few hours or less on a standard laptop.These capabilities allow researchers to study trade-offs between precision, circuit depth, and resource requirements, and to build practical intuition about the behavior of QPE building blocks. The toolbox is therefore designed primarily as a pedagogical and exploratory platform, helping bridge the gap between theoretical proposals and their concrete implementation constraints.Open, collaborative, and evolvingThe QPE Toolbox is released as open source and is intended to evolve with the community. Future developments will include variational circuit synthesis, compressed fermionic encodings, and larger-scale tensor-network simulations.The toolbox is available on GitHub: https://github.com/quobly-sw/qpe-toolboxDocumentation and example workflows are provided to help researchers explore the different components of the QPE pipeline.“Our goal is to provide a practical, numerical playground for QPE, one that helps researchers move beyond purely theoretical cost models and develop realistic intuition for fault-tolerant quantum algorithms,” said Thibaud Louvet, Quantum Algorithms Scientist at Quobly.“By combining state-of-the-art quantum algorithms with advanced tensor-network techniques, this toolbox offers researchers a structured environment to explore and better understand the practical requirements of future quantum applications,” said Min-Hsiu Hsieh, Director of the Quantum Computing Research Center at Hon Hai Research Institute.The jointly developed software is free for use by academics and researchers. This collaboration reflects a shared commitment by Quobly and Hon Hai Research Institute to advancing algorithm-hardware co-design and accelerating progress toward practical fault-tolerant quantum computing. The end-to-end workflow of the Quantum Phase Estimation Toolbox (QPE Toolbox), jointly developed by Quobly and the Hon Hai Research Institute.About QuoblyQuobly is a pioneer in quantum microelectronics, developing silicon-based quantum chips using proven semiconductor manufacturing processes. Founded in 2022 in Grenoble, France, the company builds on over 15 years of collaborative research between world-class institutions CEA-Leti and CNRS, combining expertise in quantum physics and microelectronics. Co-founded by Maud Vinet, Ph.D. in quantum physics, author of 300+ papers and 70+ patents, and Tristan Meunier, a leading expert in semiconductor quantum engineering trained under Nobel laureate Serge Haroche, Quobly bridges science and industry to make quantum computing scalable and manufacturable.The company has a strategic partnership with STMicroelectronics to accelerate the industrialization of its silicon quantum chips. In 2023, Quobly raised €19 million, a record European seed round for a quantum hardware startup, followed in 2025 by €21 million to advance its Q100T program, a key step toward fault-tolerant quantum computing. Quobly has offices in France, Singapore, and Canada. Follow us on LinkedIn.Media contact to be adapted according to geographiesAbout Hon Hai Research InstituteThe institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has an average of 40 high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy.

7 May 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region. Together with Foxtron Vehicle Technologies, Foxconn and EMP are exploring the development for a production and research and development hub for electric vehicles in Poland. “Foxconn is deeply committed to accelerating electric mobility through open platforms, scalable manufacturing, and deep technological collaborations. We are excited to support EMP by sharing our EV platforms, vehicle development expertise and engineering capabilities to build an AI‑enabled manufacturing facility. Together, with Foxtron, we will foster local R&D and strengthen supplier networks to effectively serve the European market,” said Jun Seki, Foxconn Chief Strategy Officer for EV. “From the outset, we have designed this project around the need for a partner that combines industrial scale with technological depth. Foxconn meets these requirements – both in manufacturing and in the development and safety of digital solutions, which are now integral to the automotive sector and will remain a key source of competitive advantage,” said Cyprian Gronkiewicz, CEO of ElectroMobility Poland. The discussions, done with Poland’s Ministry of State Assets, and other institutions involved in the project, cover the scope of cooperation and is expected to lead to a detailed agreement package. Final agreement will be based on the results of negotiations and contract signing among the parties, subject to relevant regulatory requirements.   About ElectroMobility Poland S.A. ElectroMobility Poland is a state-owned company leading a key industrial project in Central and Eastern Europe focused on developing next-generation automotive manufacturing. The initiative aims to build an integrated hub combining production, R&D and competence development, enabling modern vehicle manufacturing and a strong local supply chain with European and global partners. Backed by the government, EMP offers stability, a long-term investment horizon and the ability to deliver large-scale strategic projects, supporting Poland’s transition to a modern, technology-driven economy. The company operates in a partnership model, creating opportunities for industrial, technology and financial partners to enter a growing market and co-create value within the evolving European automotive ecosystem. https://electromobilitypoland.pl/en/   About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises.The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force.Learn more at www.foxconn.com/en-us

3 May 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317) announced its second-generation low-Earth orbit satellites successfully launched Sunday from Vandenberg Space Force Base in California, marking a new phase in the field of LEO satellite communications by the world’s largest electronics manufacturer and leading technology solutions provider. The PEARL-1A and PEARL-1B, launched via the SpaceX Falcon 9 rocket as part of the CAS500-2 rideshare mission, both entered their intended orbits. The two second-generaton LEO satellites are primarily designed for payload technology verification in the fields of communication and space science. They are scheduled to conduct on-orbit missions for a duration of one to three years. While the first-generation PEARLs, which completed their two-year mission in January this year, focused on satellite-to-ground station communication and system validation, the second-generation satellites are further equipped with Ka-band Inter-Satellite Link (ISL) payloads. This technology enables not only broadband communication between satellites and ground stations, but also peer-to-peer transmission verification between the two satellites. Additionally, they carry a Compact Ionospheric Probe (CIP) to monitor the space communication environment. These advancements allow Foxconn to utilize beam planning and constellation design tools more effectively, strengthening its future application capabilities in LEO satellite systems. Hon Hai Research Institute, the R&D arm of Foxconn, was responsible for the pre-launch system integration of the latest LEOs, and will oversee the post-launch on-orbit operations and data verification. The PEARL project demonstrates Foxconn’s strategic positioning in the space industry. The project team has accumulated extensive experience from the orbital operations of the inaugural mission through receiving stations in Taiwan, Europe, and Svalbard, Norway. The Satellite Control Center, located at Foxconn’s headquarters in Taipei, conducted daily experiments seamlessly, gathering invaluable verification data. Currently, the PEARL LEO satellite design focuses on integrating Foxconn’s proprietary camera payloads with mature internal and external components. The core function of the satellite industry – Assembly, Integration, and Testing (AIT) – aligns with Foxconn’s innovative CDMS (Contract Design and Manufacturing Service) business model. By utilizing feedback from the first-generation satellites’ on-orbit operations, the R&D team can perform iterative system optimizations, creating a closed-loop development process. Moving forward, Foxconn will continue to pursue vertical integration to increase the self-production rate of components and enhance its global competitiveness. The core value of the PEARL mission series lies in establishing "on-orbit practical experience" to continuously optimize the design and integration capabilities of next-generation satellites. The Group will accelerate its focus on diverse application scenarios, including mobile communication supplements, Direct-to-Cell, remote area connectivity, Industrial Internet of Things (IIoT), and backup communications for specific environments. It remains committed to system integration, testing verification, and high-value-added services, building its space technology expertise to provide global satellite operators and partners with comprehensive technical support and contributing innovative energy to the global LEO satellite communication industry. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

30 April 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer and leading technology service provider,has been named in TIME100 Most Influential Companies, a prestigious annual list highlighting 100 companies making the most extraordinary impact around the world. Grouped among Innovators by the well-respected magazine, Foxconn was distinguished as “one of the most important players in AI.” At the same time, Foxconn was also recognized among the inaugural TIME100 Companies Industry Leaders, a new shortlist highlighting 200 companies making an extraordinary impact in their industries. “This honor reaffirms the direction Foxconn is heading in – to become a comprehensive, world-class enterprise, with AI as its driving force,” said Foxconn Chairman Young Liu. “We firmly stand behind our global customers and partners to enable their success. We empower our employees to innovate for the good.” Of the 2026 TIME100 Companies list, TIME editor in chief Sam Jacobs wrote: “One thread running through this year’s list is the power of narrative: the ability of a company and its leader to articulate a vision worth following, and to keep communicating it long enough for the rest of us to catch up.” Foxconn’s unrivaled strengths in precision manufacturing, vertical integration and future technologies have powered its performance to record annual levels in revenue and profit, while maintaining its competitive lead across the information communications technology sector, as well as in artificial intelligence servers. Among TIME100 Companies Industry Leaders, Foxconn was grouped among manufacturing and logistics companies. To assemble the TIME100 Most Influential Companies list, in its sixth year this year, TIME solicited nominations across sectors, and polled its global network of contributors and correspondents, as well as outside experts. Then TIME editors evaluated each on key factors, including impact, innovation, ambition, and success. The result is a diverse group of 100 businesses helping chart an essential path forward.  Read about all of the TIME100 Most Influential Companies of 2026 here and Industry Leaders here. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

24 April 2026, Taipei, Taiwan – Hon Hai Precision Industry Co. Ltd. (Foxconn) (TWSE:2317) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business. Under the MOU, discussions will begin toward joint operation, including transferring 50% of shares in Mitsubishi Electric Mobility Corporation (“Mitsubishi Electric Mobility”) to Foxconn. Whether this joint operation can be formally concluded remains subject to the parties’ ability to reach mutual agreement on the commercial terms. Discussions between the parties are planned to proceed promptly, and final agreement will be based on the results of negotiations and contract signing between both parties, subject to relevant regulatory requirements. From left: Jun Seki, Chief Strategy Officer, Electric Vehicle, Hon Hai Precision Industry; and Kazunori Tanaka, Executive Officer (Associate), Automotive Equipment, Group President, Mitsubishi Electric About Mitsubishi Electric Corporation Guided by its corporate philosophy, Mitsubishi Electric Corporation (TOKYO: 6503) places sustainability at the core of its operations and values stakeholder trust – encompassing society, customers, shareholders and employees. In pursuing profitability, capital efficiency and growth, Mitsubishi Electric works closely alongside customers to develop value-added solutions that address today’s complex challenges while enhancing the company’s sustainable corporate value. Founded in 1921, Mitsubishi Electric has over a century of experience in delivering reliable, high-quality products and solutions. With over 200 group companies and approximately 150,000 employees worldwide, the company is a recognized global leader in manufacturing, marketing and selling electrical and electronic equipment and systems across a broad range of sectors, including public utility systems, energy systems, defense and space systems, factory automation systems, automotive equipment, building systems, air conditioning systems & home products, digital innovations, and semiconductor & devices. For more information, please visit www.MitsubishiElectric.com About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises.The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force.Learn more at www.foxconn.com/en-us  

Clarivate sees AI standing out in innovation activity09 April 2026, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturer and leading technology service provider, has been named in Clarivate’s Top 100 Global Innovators 2026, a milestone for the ninth year running and as the accelerating role of artificial intelligence stood out in innovation activity among peers in the prestigious ranking.   Known as the 1% of the 1%, the Top 100 Global Innovators navigate complexity with clarity and set the pace for invention quality, originality and global reach. In 2026, Foxconn was ranked 35th and part of the leading sector of electronics and computing that represented 27% of the list. From Taiwan, Foxconn was top ranked among non-semiconductor Taiwanese peers.   Mick Lin, Director of the IP Affairs Division at Foxconn said, “Our patent filings grew 15% on-year last year, with AI technology behind some of the IP. At the same time, our inventors, engineers and administrators are able to accelerate their patent application efficiency and related analysis work due to AI-enabled processes.”   Maroun S. Mourad, President, Intellectual Property, Clarivate, said: “Recognition as a Top 100 Global Innovator is a remarkable achievement given the pace of change. Multi-year winners and new entrants are investing in AI innovation as it redefines the boundaries between research, engineering and commercial execution. The leaders we celebrate today are not just responding to this shift, they are designing for it.”   The Top 100 Global Innovators account for a disproportionate share of the world’s most valuable ideas, demonstrating that innovation leadership is defined by precision and strategic intent. This year’s ranking not only celebrates enduring innovation leadership, but it also reveals the forces reshaping that leadership, with AI at the forefront. The Top 100 Global Innovators contribute an exceptional 16% of the world’s highest-strength AI inventions.   The Top 100 Global Innovators analysis is underpinned by the Clarivate Center for IP and Innovation Research. Their analyses are founded in rigorous research leveraging the proprietary Derwent Strength Index, derived from the Derwent World Patents Index (DWPI) and its global invention data to measure the influence of ideas, their success and rarity, and the investment in inventions.   Clarivate is a leading global provider of transformative intelligence, identifies and ranks theorganizations that consistently deliver high-impact inventions, shaping the future of innovation across industries. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long- term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises.

16 March 2026, San Jose, California, and Taipei, Taiwan– Hon Hai Technology Group (“Foxconn”) (TWSE:2317) plans to accelerate the adoption of next generation enterprise AI across the Asia-Pacific (APAC) region in strategic partnership with SAP SE, a global leader in enterprise applications and business AI. The partnership, announced at NVIDIA GTC 2026 in San Jose, builds on Foxconn’s ongoing AI Factory initiative, aimed at reshaping the future of manufacturing processes and supply chain management and opening new pathways for global deployment. With this partnership, Foxconn and SAP will bring together their respective technologies to help accelerate go-to-market initiatives across the APAC region and advance the deployment of AI technologies that support Foxconn’s journey toward becoming a fully digitized and AI-empowered organization. The companies will also explore new co-innovation use cases for Physical AI, SAP Supply Chain Management, and Foxconn Smart Manufacturing. “Our strategic partnership with SAP is an important step toward realizing the vision of intelligent and AI-powered manufacturing,” said Young Liu, Chairman of Foxconn. “By bringing together Foxconn’s AI computing capabilities with SAP’s expertise in enterprise applications, we are addressing one of the most complex challenges facing global industries today.” "AI is advancing at an unprecedented pace, and our partnership with Foxconn represents a powerful opportunity to accelerate enterprise AI adoption across the Asia-Pacific region," said Christian Klein, CEO of SAP SE. “Together, we are helping organizations harness technology that helps them move faster, operate more efficiently, and scale with confidence as they transform in the AI era." Looking ahead, Foxconn aims to work with SAP to help redefine how industries harness enterprise AI. By bringing together enterprise intelligence, AI infrastructure, and new pathways for real-world industrial deployment, the collaboration aims to establish a new blueprint for AI-powered manufacturing.       About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   SAP and other SAP products and services mentioned herein as well as their respective logos are trademarks or registered trademarks of SAP SE in Germany and other countries. Please see https://www.sap.com/copyright for additional trademark information and notices. All other product and service names mentioned are the trademarks of their respective companies.  

16 March 2026, San Jose, California, and Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today confirmed its unrivalled role in pacing the AI industrial revolution by exhibiting full-system AI server racks for NVIDIA Vera Rubin NVL72 platform, and, for the first time in the United States, unveiling details of its industrial humanoid robots and scalable modular data centers at NVIDIA GTC 2026. Splashing out on technology at the premier conference on artificial intelligence, the world’s largest electronics manufacturer demonstrated its deep collaboration with NVIDIA and its in-house strength in vertical integration with an array of critical components and cutting-edge systems that power NVIDIA Vera Rubin NVL72 platform. “Foxconn’s vertical integration, precision manufacturing and future technologies come into sharp relief when we work with NVIDIA year after year. This powerful partnership enables AI factories to produce intelligence efficiently and reliably for large-scale training, inference, and agentic workloads,” said Foxconn Chairman Young Liu. Double the size of the year before, the Foxconn delegation, with over a hundred executives, engineers and scientists, at San Jose this year brings expertise on the latest advances in AI factories and physical AI, sharing the newest innovations for NVIDIA HGX and NVIDIA MGX platforms. At GTC Booth 1921, the end-to-end NVIDIA AI Factory Ecosystem showcase features Foxconn’s key building blocks across mechanical design, cooling components, and power delivery that come together to accelerate integration and support rapid deployment. Foxconn will support the latest NVIDIA RTX PRO™ 4500 Blackwell Server Edition GPUswith new servers to power demanding data processing, AI, video and visual computing workloads. For the first time in the United States, Foxconn unveiled details of its AI-powered industrial humanoid robot being developed in collaboration with NVIDIA. Both at Foxconn’s booth and GTC sessions – “Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem” and “Building and Scaling AI Factories With Digital Twins and Robotics” – Foxconn experts show how the robots autonomously execute high-precision, repetitive industrial operations – including pick-and-place, screw fastening, and material handling – demonstrating reliability and operational efficiency in real-world conditions. The robotic skills derived from actual factory scenarios are the result of combining simulation-based training with on-site iteration, leveraging NVIDIA Isaac GR00T, NVIDIA FoundationPose, NVIDIA Isaac Sim and NVIDIA Jetson Thor, to enable rapid deployment and scalable rollout across manufacturing facilities. Meanwhile, the modular data center, or MDC, redefines scalability. Foxconn, with partners, are launching a new generation of AI-ready modular and hybrid architectures to meet demand from new-generation AI models for ultra-high-density compute power and electrical infrastructure. Through highly standardized and modular designs – see a small-scale model at Booth 1921 – the complex construction of an AI data center is transformed into a replicable and expandable industrialized solution, accelerating the journey for enterprises from building compute power to realizing the business value of AI. Foxconn’s Visionbay.ai, as an NVIDIA Cloud Partner (NCP), strategically collaborates with ecosystem leaders, enabling a unified “AI+Workflow” deployment architecture – bridging foundation models, platforms, applications, and compute infrastructure. Executing a global AI infrastructure strategy exceeding 1GW of deployed capacity, Foxconn is scaling from Taiwan into strategic regions worldwide, establishing strong foundations for sovereign AI. Another capability on display at GTC is Genesis, Foxconn’s WEF-recognized AI initiative. Powered by NVIDIA Omniverse and Foxconn FactoryGPT, Genesis demonstrates a fully integrated digital-physical factory. Visitors experience how AI simulates optimal strategies within digital twins and feeds decisions back to real-world production lines – forming a continuous closed-loop optimization cycle. In Smart City, Foxconn’s CityGPT integrates with NVIDIA Metropolis to advance AI-powered transportation and safety, while Smart EV features enhancing ADAS capabilities involving FoxBrain, the Group’s proprietary, traditional Chinese large-language model. Foxconn’s integrated healthcare AI ecosystem on exhibit focuses on four clinical domains, including scrub nurse collaborative robotics, colonoscopy Agentic AI, cardiovascular digital twins, and multimodal precision treatment for breast cancer. These take medical AI from standalone model applications to a fully realized agentic AI healthcare system – capable of perception, reasoning, and action – enabling scalable clinical innovation. On March 17, GTC session Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q is dedicated to breakthroughs in quantum by the Hon Hai Research Institute, Foxconn’s R&D powerhouse looking at future technologies. Information on exhibit hall and hours can be found here. Foxconn GTC sessions and visit Booth 1921 1.    Building and Scaling AI Factories With Digital Twins and Robotics [S81508] 2.    Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem [S82100] 3.    Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q [S82043]     About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

·   Advance development of competitive, zero-emission buses in Japan ·   Combines FUSO’s bus design, development and manufacturing expertise with Foxconn’s ZEV technology and global partnership network ·   New company to be established from H2 2026Mitsubishi Fuso Truck and Bus Corporation (Headquarters: Kawasaki City, Kanagawa Prefecture, President and CEO: Karl Deppen, hereafter: MFTBC) today announced plans to create a standalone bus company with partner Hon Hai Technology Group (TWSE:2317), Headquarters: Tucheng, New Taipei City, Chairman and CEO Young Liu, hereafter: Foxconn). Katsuto Kora (currently Director, Head of FUSO BUS, Mitsubishi Fuso Truck & Bus Corporation) is designated as the new company’s CEO.   The two companies previously announced the signing of a memorandum of understanding to explore strategic collaboration in zero emission, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer. Via their subsidiaries - Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – MFTBC and Foxconn plan to cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.   Today’s announcement marks the next stage in the companies’ collaboration. The new company aims to fulfil society’s demand for high quality public transportation by accelerating the development of competitive, zero-emission buses in addition to the current diesel lineup. The buses will be developed and manufactured at the company’s plant in Toyama under the FUSO name, which already has over 90 years of heritage as a CV brand. The company will be headquartered in Kawasaki, Japan.   As a bus-dedicated OEM, the new company will focus on quickly developing and launching EV buses for domestic and international markets, while continuing to improve the conventional ICE portfolio.   With local development, sourcing, production and sales channels, the company will also be able to smoothly comply with Japanese regulations, quality standards and customer needs. This will be backed by Foxconn’s ZEV expertise, high-tech competency and global partnership network to help ensure products are successful in Japan and abroad.   Karl Deppen, CEO of MFTBC: “We are excited to join forces with Foxconn. This collaboration will combine the strengths of both parties to accelerate our transformation in the bus sector. By combining FUSO and Foxconn’s extensive experience and technological know-how, we will offer customers state-of-the art solutions for public transport, thereby contributing to society both in Japan and abroad.”   “Mobility is a strategic priority for Foxconn,” said Jun Seki, Foxconn Chief Strategy Officer for EVs. “This collaboration with MFTBC will provide a comprehensive electrification solution for Japan’s transportation ecosystem. This approach will significantly shorten development cycles and enhance cost-efficiency.”   Katsuto Kora, designated CEO of New Bus OEM: “The new joint venture will integrate the corporate cultures of both companies, blending Japan’s spirit of manufacturing excellence with Foxconn’s agility and technological prowess. Given the extensive existing partnerships of both shareholders, we expect even broader collaboration opportunities in the field of future technologies in the years to come. Our focus will be on meeting customer expectationsnot only for current conventional ICE improvement but also for zero-emission transportation and leading FUSO bus into a new era of digitalization and electrification.”   Having signed the definitive agreements today, MFTBC and Foxconn aim to close the transaction in the second half of 2026. The transaction is subject to all parties involved reaching an agreement and receiving approval from the relevant Boards, shareholders and authorities. MFTBC at a Glance Mitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.   Foxconn at a Glance Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   Foxtron at a Glance Established in 2020, Foxtron Vehicle Technologies is Taiwan’s only company with full vehicle design, development, and system validation capabilities. Leveraging decades of expertise from Hon Hai Technology Group (Foxconn) and Yulon Group in the ICT and automotive industries, Foxtron operates under the CDMS (Contract Design and Manufacturing Service) business model. With an open platform strategy, Foxtron aims to “Root in Taiwan, Expand Globally”, working alongside Taiwan’s ICT and automotive industries to drive international expansion and establish the next-generation EV ecosystem.   MFBM at a Glance Founded in1950, Mitsubishi Fuso Bus Manufacturing (MFBM) has been delivering high-quality buses to satisfied customers for over 75 years. With a state-of-the-art production facility located in Toyama, the company has achieved certification to international quality and environmental standards (ISO9001 since 2001, ISO14001 since 2003 and ISO/IATF16949 since 2018). MFBM manufactures its light duty ‘Rosa’ bus in dozens of markets worldwide and also produces large buses for both the long-distance coach (Aero Queen/Aero Ace) and city (Aero Star) segments.

18 December 2025, Taipei, Taiwan – The Hon Hai Research Institute (HHRI) is pleased to announce the successful completion of Round 1 of the Australian Quantum Software Network (AQSN) Micro & MesoGrant Scheme. In this inaugural round, HHRI, as the key sponsor, awarded more than AUD 150,000 in competitive funding to support early-career and mid-career researchers across Australia in advancing quantum software and algorithmic research. The AQSN MicroGrant / MesoGrant programs are funding schemes designed to support research in quantum algorithms, quantum software, and quantum theory. AQSN members—including students and researchers—may apply. The MicroGrant is suitable for short-term or early-stage open-source projects, while the MesoGrant supports mid-scale or collaborative research efforts. Funded projects typically run for 6–12 months and require outcomes to be open-sourced and publicly shared, fostering collaboration and knowledge exchange within the quantum software community. AQSN founder and Review Committee member Dr. Simon Devitt stated: ”We sincerely appreciate the support from the Hon Hai Research Institute’s Quantum Computing Research Center and the enthusiastic participation of the Australian quantum research community. Congratulations to all the award recipients. HHRI’s generous sponsorship has enabled AQSN to empower the next generation of quantum pioneers and to build a vital bridge between academic excellence and industrial impact. We are honored to collaborate with HHRI in establishing a strong software foundation for the quantum era.” Dr. Min-Hsiu Hsieh, Director of HHRI’s Quantum Computing Research Center, said:“Scientific breakthroughs often originate from a small yet bold idea. At the Hon Hai Research Institute, we are committed to becoming a catalyst for innovation. By supporting AQSN’s young scholars, we hope to inject fresh momentum into the field of quantum computing. This collaborative initiative represents HHRI’s commitment to nurturing the next generation of quantum talent, and we look forward to seeing students and researchers become key forces driving global quantum technology development.” A total of 9 projects were selected, including six MicroGrants and three MesoGrants fully sponsored by HHRI. These projects reflect the depth and creativity of Australia’s quantum research community, ranging from foundational theory to practical algorithmic development. The successful recipients and their project topics are listed below: MesoGrant Recipients 1.       Clément Canonne (University of Sydney) — Towards Understanding Which Quantum Circuits Can Be Classically Sampled 2.       Harini Hapuarachchi (RMIT University) — Towards a Unified Software Toolkit to Simulate Noise in Diamond-Based Room-Temperature Spin Qubits 3.       Angus Southwell (Monash University) — Quantum Gibbs Sampling via Simplicial Complexes MicroGrant Recipients 1.       Jonas Freiheit (RMIT University) — Optimising Encoding & Readout for Quantum Reservoir Computing Based on Quantum Ising Models 2.       Elija Perrier (University of Technology Sydney) — Coherent Learning for Quantum Agents 3.       Abhinash Kumar Roy (Macquarie University) — Resource-Efficient Characterisation of Multi-Time Quantum Processes 4.       Varun Srivastava (Macquarie University) — Randomised Benchmarking as a Diagnostic for Non-Markovian Noise and Fault-Tolerance Thresholds 5.       Mingyu Sun (University of Technology Sydney) — Scalable Fidelity Estimation and Learnability from Local Measurements 6.       Tianhui Zhu (UNSW) — Implementing Virtual Distillation with Quantum Algorithms HHRI extends its gratitude to the AQSN assessment committees and the entire Australian quantum research community for their enthusiastic participation. Congratulations to all awardees. Hon Hai Research Institute remains committed to supporting quantum research and innovation worldwide, fostering academic collaboration, and accelerating the development of next-generation quantum technologies. We look forward to supporting future rounds of this scheme and the exciting research that will emerge as a result. About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy. To learn more, visit https://www.hh-ri.com