·      4Q26 demand strong, raising FY26 outlook for all 4 major product segments ·      Optimistic for 2027; net profit in 3Q26 sets new quarterly record ·      AI business yielding better profitability and capital efficiency ·      Key components demand surpassing supply is shared challenge for AI, ICT supply chains 12 November 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317) today announced its third quarter 2026 financial results. Revenue, gross profit, operating profit, and net profit for the third quarter and the first nine months of the year all reached record highs for the respective periods. Earnings per share (EPS) reached NT$5.51 for the July-September quarter and NT$13.35 for the January-September period – both representing sharply higher growth compared to same periods last year. Looking ahead to the fourth quarter, the company anticipates strong growth on both a quarterly and on-year basis. While the target for strong full-year growth remains unchanged, the outlook for all four major product segments has been revised upward. The company maintains a positive outlook for AI and smart consumer electronics products for the coming year and, for the first time, expressed an optimistic view regarding performance in 2027. In the third quarter, Foxconn recorded revenue of NT$3.02 trillion, up 46% on-year; gross profit of NT$181.5 billion jumped 39% at the same time; operating profit at NT$115.4 billion surged 64%; and net profit (attributable to owners of the parent company) of NT$77.5 billion, climbed 34% from a year ago. These figures also represent quarterly growth of 19%, 17%, 22%, and 29%, respectively, over the second quarter. EPS for the July-September period reached NT$5.51 – an increase of NT$1.36 from NT$4.15 in the same period a year ago, and up by NT$1.24 from the second quarter. Gross margin, operating margin, and net margin stood at 6.02%, 3.83%, and 2.57%, respectively. Net profit after tax also hit a new record for any quarter. For the January-September period, cumulative revenue reached NT$7.66 trillion, 39% higher on-year; with gross profit at NT$467 billion, up 35%; operating profit at NT$285.8 billion, rising 65%; and net profit (attributable to owners of the parent company) increasing 30% to NT$187.4 at the same time. Gross margin, operating margin, and net margin were 6.10%, 3.73%, and 2.45%, respectively, reflecting ongoing optimization of the company’s core operational profitability. EPS for the first three quarters of this year reached NT$13.35, an increase of NT$2.97 from the NT$10.38 recorded in the same period last year. The conference marked Foxconn’s return to an in-person quarterly investor meeting since the pandemic, with the option for online participation. Chairman Young Liu stated that in-person interaction provides investors with a deeper understanding of the company’s recent developments and future outlook. Going forward, Foxconn plans to hold hybrid (in-person + online) investor conferences annually around this time of year. Reflecting on the third quarter, the cloud and networking products segment – bolstered by robust demand for AI servers – exceeded even the most optimistic initial forecasts, serving as the primary driver behind the Group’s record-high revenue. Chairman Liu noted that AI servers have become Foxconn’s most significant growth engine and will continue to facilitate the optimization of both the company’s product mix and its client base. FY26 outlook raised for all 4 major product segments Looking ahead to the fourth quarter, Chairman Liu stated that the AI business is set to continue its growth. Combined with the arrival of the traditional peak season for ICT products, overall revenue is expected to show strong growth both sequentially and from year-ago levels. Specifically, with the shipment of a new generation of AI server racks, revenue from AI servers is projected to continue growing on a quarterly basis, while general-purpose servers are expected to see moderate growth. Together, these factors will drive significant on-quarter and strong on-year growth for the company’s cloud and networking products. The smart consumer electronics products segment is in its peak shipment period for the fourth quarter. With robust product demand and higher average selling prices, strong growth is anticipated both on a sequential and on-year basis. The computing products segment continues to be affected by tight memory supply, leading a likely slight decline quarter-over-quarter; however, rising prices for certain components have driven up average selling prices, pointing to significant year-over-year growth. Meanwhile, components and other products segment is expected to see significant quarter-over-quarter growth, supported by an increase in shipments related to core business operations. Regarding the full-year outlook, Chairman Liu indicated the target for strong growth remains unchanged. However, as operational visibility has improved since the investor conference in August, the company has raised its outlook across all four major product segments. Operational performance for the year has consistently exceeded initial expectations, a trend that is expected to continue into next year. Optimistic for 2027, focus on key component supply and external shifts Looking ahead to 2027, Chairman Liu stated that, based on current customer demand, he is confident in continued operational growth for the coming year. However, he noted that developments within the supply chain and the broader external environment warrant close attention. At present, tight supplies of chips, memory, and certain key components pose a shared challenge for the AI and consumer electronics supply chains. While the rollout of new production capacity will gradually alleviate these bottlenecks, overall demand is expected to continue exceeding supply next year, and tight market conditions may persist for some time. Furthermore, uncertainties in the global political and economic landscape – along with inflation, interest rates, and exchange rate fluctuations – can all impact operating costs, investment decisions, and supply chain configurations. Chairman Liu emphasized that in the face of such external shifts, robust corporate management capabilities become even more critical. He noted that the talent, capital, and supply chain management expertise that Foxconn has cultivated over the long term serve as a vital foundation for the Group’s positive outlook on future market prospects. AI growth is translating into returns As its AI business grows rapidly, Foxconn continues to use metrics such as Return on Equity (ROE), operating margin, and EBITDA to demonstrate the profitability and capital efficiency gains resulting from its operational expansion. Chairman Liu noted that during the period when product segments of smart consumer electronics and computing were the primary revenue drivers, the Group’s ROE generally remained below 10%; however, since cloud and networking products became the largest source of revenue last year, ROE has surpassed 11%. In the first three quarters of this year, the return on equity (ROE) reached 10.44% – a significant improvement over the same period last year – bringing the figure closer to the annual target of 12%. Chairman Liu noted that investments in the AI business are not only driving revenue growth, but are also yielding increasingly better profitability and capital efficiency. The Group has already begun discussions regarding a higher ROE target for the next phase, with the aim of consistently generating superior returns for shareholders. Regarding core business profitability, the growth in operating profit for the first three quarters of both 2024 and 2025 has consistently outpaced the growth in revenue and gross profit, with the gap continuing to widen. In the first three quarters of this year, operating profit increased by 65% year-on-year – a reflection of the Group’s ongoing improvements in vertical integration, automation, and operational efficiency. Coupled with the gradual realization of economies of scale, these factors have driven a strengthening of core profitability. Chairman Liu noted that, although the increase in unit selling prices has impacted profit margins, the operating profit margin for the first three quarters of this year still rose to 3.73% – a significant improvement over the 3.2% recorded for the full year last year, and a figure that also exceeds the 3% threshold set by the Group. Core business cash generation strengthening As investments in AI infrastructure continue to expand, Foxconn remains focused on the cash-generating capacity of its core business. The Group’s EBITDA for 2025 reached nearly NT$357 billion – more than double the figure recorded in 2020. In the first three quarters of this year, EBITDA has already surpassed the total for the entire previous year, reaching NT$369.2 billion – an increase of NT$123.6 billion, or 50.3% year-on-year – which outpaces the 43% growth in capital expenditures over the same period. Chairman Liu pointed out that the widening gap between EBITDA and the sum of capital expenditures and cash dividends, demonstrates that the cash-generating capacity driven by the growth of the AI business not only supports future capital expenditure requirements and higher cash dividends, but also further strengthens the company’s financial position, preserving the flexibility needed for future development. Regarding capital management, Foxconn adheres to the principle of "matching long-term funding with long-term investments, and short-term funding with short-term operational needs" – the latter being managed flexibly through borrowing and the optimization of the cash conversion cycle. With a debt-to-equity ratio of approximately 64%, the Group retains capacity to meet future capital requirements by issuing corporate bonds. Furthermore, it will employ flexible financing strategies – primarily through convertible bonds – to ensure a diverse mix of funding currencies while effectively managing the cost of capital. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 1 million employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

·      MODEL A+expands B2B product portfolios in fastest-growing B-segment SUV ·      MODEL K+ SUV playful styling gives nostalgic touches of Japan with neo city pop ·      MODEL Ktaps into kei-class trucks with design language of MODEL T ·      Flexing CDMS strength to accelerate electromobility for automotive clients30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317) on Friday flexed its contract design and manufacturing service (CDMS) strength for automotive clients by unveiling three new reference electric vehicles aimed at under-penetrated markets, while offering cost competitive options and flexible design platforms. Two eye-catching SUVs, the MODEL A+ and MODEL K+, alongside the MODEL K compact truck, extend Foxconn’s electromobility progress into the kei-class trucks popular in Japan and brings the Group’s EV range to a total of 12 reference models. “The new reference EVs join Foxconn’s emerging ecosystem in electromobility that is accelerating time-to-market, time-to-cost and time-to-technology for our customers and partners,” said Jun Seki, Foxconn Chief Strategy Officer for EV. All three new models were on display at Hon Hai Tech Day 2026 (HHTD26), the flagship annual technology conference of the world’s largest electronics manufacturer and the world premiere stage for the Group’s B2B electric vehicles. On the exhibition floor in Taipei, Foxconn’s electromobility ecosystem included demos of full stack, made in Taiwan battery developments from materials to cells and packs to BMS; E/E architecture; and powertrains for E2W and E3W. Among EVs on display, a right-hand drive MODEL B gave attendees a chance to check out the result of CDMS collaboration, while onstage, Honda R&D and Mitsubishi Electric Mobility discussed, in separate remarks, their electromobility developments with Foxconn. MODEL A+ An expressive luxury style yet authentic SUV for affluent drivers, the MODEL A+ is a deliberate move to expand B2B product portfolios in the fastest-growing B-segment SUV. With In-Wheel Motor technology and selectable EEA, a wild exterior design but ultimate space interior addresses flood capability emergencies, temporary living space and backup power for glamping and camping eletromobility lifestyles.   MODEL K+ This is an expressive yet affordable SUV designed for active youth. Playful styling with nostalgic touches recall Japan’s city pop music era of the ‘70s and ‘80s, but with a neo city pop take for the modern day. The highly distinctive lifestyle SUVfor a niche market targets B2B looking to develop their own brand’s lifestyle SUV EV, as well as OEMs looking to offer affordable yet distinctive vehicles for younger customers. With In-Wheel Motor technology, the MODEL K+ offers personalization of exterior, interior, driving range, and EEA for purpose-built capability at a competitive price. MODEL K This is a functional yet futuristic truck for forward-thinking business owners. Aimed at the specialized commercial kei truck class, the MODEL K finds use as last-mile and mobility service applications. Its alignment to support compliance to environmental regulations makes it attractive for decarbonization-focused entrepreneurs, municipalities, and government agencies while offering lower total cost of ownership (TCO) through reduced energy and maintenance costs.A functional beauty, inspired by the design language of Foxconn’s award-winning MODEL T electric bus, the canopy-ready MODEL K conceptualizes a lower bed height and longer bed length. Other reference EV models to-date: ·      MODEL T large bus ·      MODEL C passenger SUV ·      MODEL E luxury sedan ·      MODEL B crossover SUV ·      MODEL V truck ·      MODEL N cargo van ·      MODEL D LMUV ·      MODEL U midi-bus ·      MODEL A modular B-segment  

NVIDIA technologies support clinical AI orchestration, runtime security and digital twins across Foxconn’s healthcare ecosystemOctober 2026, Taipei, Taiwan – At Hon Hai Tech Day 2026 (HHTD26), Foxconn’s Smart Healthcare exhibition showcases its vision for AI-driven healthcare across the care continuum, organized around three key areas: AI-Assisted Diagnosis & Digital Twins, Embodied AI, and Smart Healthcare Manufacturing. By integrating AI agents, embodied AI, and multimodal medical models, Foxconn connects clinical decision-making with intelligent devices, hospital workflows, and manufacturing capabilities. The exhibition demonstrates Foxconn’s end-to-end integration expertise, spanning AI software, edge computing, robotics, and healthcare manufacturing to build a comprehensive smart healthcare value chain. Foxconn brings together its ecosystem, real-world deployment environments, products, edge-to-cloud infrastructure, and hardware-software integration. Aligned with NVIDIA’s “Five-Layer Cake” AI strategic framework, this approach connects AI technologies with intelligent medical devices and real clinical environments, advancing healthcare AI from individual proof-of-concept applications toward integrated systems and real-world clinical deployment. CoDoClaw: Advancing from AI Models to Clinical AI Agents As a key highlight of the exhibition, CoDoClaw, Foxconn’s Clinical AI Orchestrator, marks a significant milestone in the evolution from AI models to AI agents. Jointly developed by Foxconn and Tung’s Taichung MetroHarbor Hospital, CoDoClaw focuses on diabetes and cardiometabolic multimorbidity management. By integrating multimodal medical models with agentic AI, it connects data and AI capabilities across specialties and healthcare systems, advancing clinical applications from standalone diagnostic support to cross-specialty decision-making and workflow coordination. Built on NVIDIA NemoClaw open agent blueprint and NVIDIA OpenShell secure runtime software, CoDoClaw is designed to interpret clinical contexts, reason through tasks, and orchestrate AI agents within defined clinical workflows. To address the stringent security requirements of healthcare environments, CoDoClaw integrates centralized security policy management, sandbox isolation, and runtime access controls, alongside NVIDIA Sentryagent identity and delegated authority verification capabilities. Together, these mechanisms strengthen runtime security, mitigate risks such as unauthorized actions, sensitive data exposure, and credential leakage, and establish a trusted foundation for the responsible adoption of autonomous AI agents in clinical settings. Extending AI Clinical Capabilities Across Diverse Healthcare Settings Foxconn is also extending its AI-powered clinical capabilities into a variety of diagnostic and care environments. In the telemedicine zone, CoDoctor EKG Screener, an AI-powered electrocardiogram analysis system, brings real-time cardiovascular risk screening and anomaly alerts beyond hospitals into home-based care, community healthcare, and postoperative monitoring environments. At the endoscopy center, CoDoctor Endovia, an AI-assisted colonoscopy analysis software solution, is jointly developed by Foxconn, Kaohsiung Medical University Chung-Ho Memorial Hospital, YUAN High-Tech, Yuan Yu Industry, By integrating edge AI into endoscopic examination workflows, the solution provides real-time lesion detection, pathological classification, bowel preparation quality monitoring, withdrawal speed analysis, and intraoperative 3D navigation. These capabilities help improve examination quality and diagnostic consistency. Integrated Chemotherapy Compounding and Delivery System A major exhibition highlight is the Integrated Chemotherapy Compounding and Delivery System, developed through collaboration among Foxconn, Taipei Veterans General Hospital, Kawasaki Heavy Industries, Yuyama Manufacturing, and FARobot. The system brings together automated medication compounding, in-hospital logistics, and clinical delivery into an integrated healthcare automation ecosystem. Using NVIDIA Omniverse libraries, Foxconn builds digital twins to simulate and evaluate chemotherapy compounding, robotic transport and delivery workflows before deployment, allowing  high-risk chemotherapy workflows to be simulated, monitored, and continuously optimized. It integrates ChemoRo the Spike automated chemotherapy compounding equipment, FARobot autonomous mobile robots, and Foxconn’s Nurabot nursing collaborative robot to coordinate the entire workflow, from compounding and transportation to distribution and clinical delivery. By connecting these systems into a coordinated, end-to-end workflow, Foxconn aims to enhance medication safety, improve clinical efficiency, and increase operational reliability in complex hospital environments.

·      Flagship annual technology conference held for 7th year, celebrates tech partnerships ·      Record 321 exhibits demonstrate vertical integration and precision manufacturing ·      20-meter long wall shows components to system integration of next-gen AI infra ·      Most embodied intelligence assembled at HHTD2630 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday confirmed its industrial leadership in token factory solutions with an unprecedented look at components and system technologies enabling next generation AI infrastructure and by giving spotlight to its storied partnerships for the first time. At the 7th annual Hon Hai Tech Day 2026 (HHTD26), Foxconn laid bare the world-beating vertical integration and precision manufacturing strengths behind its work on the NVIDIA Vera Rubin platform, from rack-level full AI supercomputing system integration to sub-micron-level component manufacturing technologies. In two firsts, Foxconn showcased NVIDIA DSX POD, a standardized, factory-built reference design that enables partners to preintegrate NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers, complete critical validation before shipment and connect the units to prepared site infrastructure after delivery, dominated the venue and welcomed visitors, while a new customer zone with key moment photos and milestone technology timelines paid homage to behind-the-scenes partnerships that have captured the imagination of the technology industry. “Foxconn is transforming into a technology manufacturing platform service provider,” said Foxconn Chairman Young Liu. “From testing to the tangible, our vertical integration and precision manufacturing makes the impossible possible. We are building this kind of strength across ecosystems of smart consumer electronics to AI and EV, as well as in space and robotics.” Among a record 321 exhibits at HHTD26, a quarter comprised the Token Factory zone. Extreme co-design is a visual tour at a 20-meter long wall exhibiting PCBs mounted with tens of thousands of micron-level precision-engineered components; AI server cable-free, hose-free and fanless compute tray design in a single generation; next AI megatrend co-packaged optics (CPO); and power, cooling and high-speed data solutions re-imagined for more efficient AI infrastructure. An immersive simulated AI data hall demonstrated how AI compute, networking, power and cooling are co-designed for an AI factory, including NVIDIA 800 VDC power distribution. Foxconn’s dedicated business unit for AI supercomputing & cloud operations and an NVIDIA Cloud Partner, Visionbay.ai, is planning its facility design to follow NVIDIA DSX MaxLPS principles to maximize AI factory performance per watt within a fixed power envelope and optimize computing, power and cooling configurations ahead of construction. Onstage, NVIDIA, Google LLC, and Schneider Electric discussed AI infrastructure; Honda R&D Co Ltd and Mitsubishi Electric Mobility discussed next generation electromobility. The most embodied intelligence for HHTD26 assembled in the Robotics and Humanoid zone, showing the potential of a growing ecosystem and demonstrating real-world application examples of industrial products used in robotics. In another first, Foxconn leaned into its rich heritage in ultra-precision manufacturing processes backed by its proprietary machining, materials processing, and mold making equipment with a Precision Manufacturing zone dotted with technologies that have resulted in Poketomo AI companion robots and one-punch enclosures for laptops. Among the exhibits, the importance of AI safety was a common thread as Foxconn teams demonstrated how the NVIDIA Open Agent Safety Platform could support agent safety across smart healthcare, smart manufacturing and robotics, and smart city. HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference launched for the first time a family-friendly pavilion for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city. For more on Hon Hai Tech Day 2026 here. About Foxconn here.

TECO Electric & Machinery Co. (1504) returns to Hon Hai Tech Day today (October 30) for the second year, highlighting their collaboration with Foxconn  on a Modular Data Center (MDC) concept based on the NVIDIA DSX POD reference design. The exhibit integrates IT racks, cooling and power distribution systems within a 40-foot container, demonstrating TECO’s one-stop integration and delivery capabilities spanning critical equipment and electromechanical engineering. Since forming a strategic alliance with Hon Hai Technology Group (“Foxconn”) (2317) through an equity swap last year, TECO has continued to deepen the collaboration and leverage the benefits of vertical integration to capture infrastructure opportunities driven by growing demand for AI computing. TECO Group Chairman Morris Li said, “AI is reshaping competition across industries worldwide. Data centers have become critical infrastructure supporting the expansion of computing capacity and industrial transformation. TECO’s modular solutions integrate power, cooling, engineering and energy management. Through TECO’s acquisition of Malaysia-based Dynaciate (now renamed TECO NXG Integrated Services Sdn. Bhd.), we are accelerating the Group’s strategy to become an “AI data center solutions provider.” By expanding our capacity to undertake modular data center engineering projects and completing more than 80% of the modularization process in the factory, we can shorten delivery lead times, helping customers accelerate deployment and strengthen their competitiveness.” Combining Equipment Manufacturing and Engineering for Faster Deployment The  concept for an All-in-One MDC based on NVIDIA DSX POD on display houses IT racks, AC/DC control panels, cooling systems, an energy management system (EMS) and fire protection equipment in a 40-foot container, demonstrating the integrated configuration of computing equipment and electromechanical infrastructure. TECO is committed to serving as customers’ partner for modular data center infrastructure and electromechanical integration, combining its core capabilities in power equipment, cooling and thermal management, and module manufacturing to provide integrated solutions for high-density AI computing. NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories built by partners inside modular containers, integrated and validated before delivery. DSX POD moves the integration and installation of computing, networking, cabling, rack-level power and liquid cooling to the manufacturing facility, reducing the extensive planning, construction, specialized labor and logistics of a traditional onsite build.   In addition to the DSX POD-based MDC concept with Foxconn, TECO’s MDC solutions comprise five core modules: IT, cooling, power, generators and EMS. Each configuration can be tailored to customer requirements, site conditions and reliability needs. Through modular design and factory prefabrication, some assembly work that would otherwise be performed on site can be completed in the factory before installation and system integration on site. This helps reduce construction complexity while improving project quality and delivery efficiency. Customers can also deploy and expand capacity in stages based on their computing needs, allowing infrastructure scale to grow flexibly with their business. TECO is currently carrying out a megawatt-scale MDC project in Malaysia, applying this integrated approach in an actual deployment to meet major cloud service providers’ needs for fast deployment and flexible expansion. The project is expected to be completed and showcased by year-end. Integrating Power and Thermal Management for High-Density AI Computing TECO has extensive experience in data center infrastructure, having undertaken projects with a cumulative capacity of 1 GW. As AI computing density continues to rise, reliable power and efficient cooling have become critical to data center design, increasing the need for closer integration between power and cooling systems. Alongside its MDC, TECO is exhibiting an 800VDC high-voltage direct current power architecture and Solid-State Transformer (SST) technology, demonstrating approaches to reducing power transmission and conversion losses. The SST also provides electrical isolation to support the power requirements of high-density server racks. On the cooling side, TECO brings together three key solutions: the CDU Pump + Industrial Flat-Wire Power Module, the Process Cooling Water (PCW) System, and the Integrated Dual Cooling Series Water chiller/Heat Pump. These systems work together to connect the server-side and facility-side cooling circuits. Through high-efficiency drive systems, integrated piping, and coordinated configuration of the chiller and centralized control system, the solution addresses the cooling, space and modular expansion needs of high-density server racks. This demonstrates TECO’s ability to extend from critical equipment supply to integrated power and thermal management solutions for data centers. Applying Electric Drive Expertise to Robotics and Physical AI In addition to its modular data center solutions, TECO is also exhibiting the M1/M2 Quadruped Joint Module, the TJM Humanoid Joint Module, and the UTX Application-Specific Joint Module. These modules are designed for highly dynamic motion, whole-body joint control, and heavy-load applications, respectively. Potential applications include legged mobile robots, humanoid robots, industrial automation and smart logistics. Through these joint modules, TECO is extending its core electric drive expertise into robotics, demonstrating its potential to expand beyond conventional electromechanical equipment into Physical AI.

30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday showcased modular container built on NVIDIA DSX POD, the fastest path to productive intelligence at scale, to its annual technology fest in Taipei. NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories inside modular containers, integrated and validated before delivery. The units arrive ready to connect out of the box to a prepared site’s power, cooling, networking and other supporting infrastructure, reducing deployment time from six months to as little as 14 days. Partners, including Foxconn, complete rack-to-rack cabling, wiring, piping and functional validation before shipment. The DSX POD-based modular container at the 7th annual Hon Hai Tech Day 2026 (HHTD26) represents the strong, long-standing collaboration between NVIDIA and Foxconn and comes on the heels of its recent announcement at NVIDIA GTC Berlin. HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference is attracting thousands of attendees. Free entry on the second day, a family-friendly pavilion opens for the first time for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city.

Cross-border collaboration advances potential new solution for CCS corrosion mitigation; visitors welcome October 30–31October 30 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest technology manufacturing platform service provider, will showcase a novel approach to CCS corrosion prevention, developed in collaboration with UK-based Pace CCS Holdings Ltd, at Hon Hai Tech Day 2026, taking place October 30–31 at Taipei Nangang Exhibition Center, Hall 1. Laboratory proof-of-concept of an approach to inhibiting acid corrosion has been completed, offering a potential new solution to improve the safety of CO₂ transport and storage in the carbon capture and storage (CCS) industry at lower cost. Pace CCS Chief Technology Officer, Matthew Healey, will share technology trends and the results of the collaboration at the Sustainability Forum Trace impurities in CO₂ streams can form strong acids under certain conditions, potentially leading to corrosion - a significant challenge for CCS infrastructure. Laboratory testing has confirmed that a semiconductor-grade chemical scavenger has the potential to remove key oxidizing constituents, suppressing strong-acid formation at its source versus the need for additional processing to remove impurities, potentially lowering barriers to adoption. Testing began in Taipei in November 2025. Results showed that, under the test conditions, the addition of the scavenger prevented acid corrosion of metal coupons, whereas the untreated control samples exhibited visible corrosion. These findings provide a foundation for evaluating future applications. Ron R. T. Horng, Chief Environmental Officer of Hon Hai Technology Group, said: “As Foxconn advances its net-zero transition, we are also working to apply our manufacturing and systems integration experience to carbon-reduction technologies. By bringing together Foxconn’s capabilities in precision manufacturing, gas-reaction control and piping design with Pace CCS’s engineering expertise, we aim to move the results of laboratory validation progressively toward industrial applications and deliver more practical solutions for net zero.” Matthew Healey, Chief Technology Officer of Pace CCS, said: “Acid-driven corrosion is a critical cost driver in CCS operations. While raising CO₂ purity standards can mitigate risk, it sharply increases upstream treatment costs. By deploying a chemical scavenger to inhibit acid-forming reactions at the source, this potentially offers a more cost-effective solution. Pace is proud to have provided innovative thinking and technical support during laboratory testing. We look forward to continuing our technical support as the technology advances into the next stages of testing and validation.” Provided corrosion risks can be adequately managed, the technology could allow some systems to transport and store CO₂ with higher impurity levels, enabling more emissions sources to participate in storage networks, expanding the potential reach of CCS and reducing costs. Ruth Bradley-Jones, Representative of the British Office Taipei, said: “The collaboration between Foxconn and Pace CCS demonstrates the complementary strengths of Taiwan’s manufacturing and systems integration capabilities and the UK’s expertise in carbon capture and storage. We welcome efforts by businesses from both sides to explore industrial decarbonisation solutions and look forward to seeing continued technical exchange and collaboration translate innovative ideas into practical applications that support the net zero transition.” The CO₂ corrosion mitigation technology will be featured in the Environmental Intelligence exhibition area at this year’s Hon Hai Tech Day, giving visitors an opportunity to learn about the purification process and its potential applications. Foxconn will continue working with international companies collaboratively to advance innovation and research in carbon capture and expand viable pathways toward net zero. October 30 is an invitation-only opening day, while October 31 is open to the public. Registration and admission arrangements are subject to the event organizer’s announcements. About Hon Hai Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 1 million employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us   About Pace CCS Pace CCS is a boutique engineering and advisory consultancy dedicated to making CCS projects bankable, scalable, and cost-effective. Working quietly behind the scenes on the flagship developments shaping the industry’s future, the firm brings deep technical expertise from supporting CCS projects worldwide. Pace CCS delivers practical engineering and grounded problem-solving to overcome complex technical challenges, lower project costs, and de-risk investments.

Foxconn is building an AI factory that turns industrial data into intelligence to power a self-learning manufacturing ecosystem. Using NVIDIA infrastructure and software, the company trains AI models and deploys specialized agents that support real-time decisions across manufacturing, electric vehicles, and smart cities. At the center is FoxBrain, Foxconn’s proprietary large language model, developed by adapting open foundation models with industrial data. FoxBrain supports specialized platforms, including Genesis for manufacturing and CityGPT for urban services. NVIDIA DGX SuperPOD serves as the AI factory’s training foundation. Foxconn reports 2.48x faster training for 120-billion-parameter models compared with its previous H100-based systems, processing one trillion tokens in 12 days. NVIDIA software helps manage infrastructure and deploy AI agents across more than 200 facilities. The company reports practical manufacturing improvements: 25% fewer labor hours spent on production scheduling. 50% less engineering workload for injection-molding process changeovers. More than 20 major defect root causes addressed, with a correction rate exceeding 90%, on surface-mount production lines. Foxconn also uses NVIDIA RTX PRO servers, Omniverse, and Isaac to simulate factories and robots before deployment, helping replicate production lines globally. Through its subsidiary Visionbay.ai, an NVIDIA Cloud Partner, Foxconn is extending its AI factory leveraging NVIDIA-Certified Systems to deliver AI-as-a-Service to enterprises and governments across Asia. Discover how Foxconn and NVIDIA are architecting the future of industrial intelligence. Read the full Foxconn DGX SuperPOD case study.

Will leverage “Made in/by Japan” brand to support sustainable growth of Japanese automotive industry16 October 2026, Taipei, Taiwan, Tokyo Japan – Lin Yin International Investment Co., Ltd. (Lin Yin), an investment management subsidiary of Hon Hai Precision Industry Co., Ltd. (Hon Hai Precision Industry) (Foxconn), and Mitsubishi Electric Corporation (Mitsubishi Electric) announced today that they have formalized a strategic alliance for the joint operation of an automotive equipment business. Through the alliance, the companies aim to develop next-generation mobility and thereby strengthen the sustainable growth of the Japanese automotive industry. Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility Co., Ltd., which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility. The share transfer price is expected to be JPY 115.0 billion. The share transfer agreement establishes an enterprise value of JPY 320.0 billion and an equity value of 230.0 billion for the target business. The transfer price corresponds to a 50% stake to be transferred based on the equity value. Subject to the satisfaction of contractual conditions, including obtaining required approvals and clearances from relevant authorities under competition laws and other applicable laws and regulations, the share transfer is expected to be completed on October 1, 2027. The joint-operating arrangement will combine Mitsubishi Electric Mobility’s technological and developmental capabilities, particularly in electric powertrains, software and vehicle control, with Hon Hai Precision Industry’s speed, scale and other strengths in market deployment. By providing high-quality electric-vehicle platforms (basic structures) developed in Japan, the companies expect to contribute to the widespread adoption and advancement of next-generation mobility. The alliance will translate advanced technologies and quality achieved through high-level Japanese manufacturing into new value for mobility. In turn, this is expected to strengthen Japan’s industrial base and support the sustainable growth of the domestic automotive industry. In addition, over the medium to long term, the companies aim to expand Japanese technology and quality to global markets as well as further enhance the value of “Made in/by Japan” and demonstrate new possibilities for Japanese manufacturing to the world. About Hon Hai Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 1 million employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us About the Mitsubishi Electric Group Guided by its corporate philosophy, Mitsubishi Electric Corporation (TOKYO: 6503) places sustainability at the core of its operations and values stakeholder trust—encompassing society, customers, shareholders and employees. In pursuing profitability, capital efficiency and growth, Mitsubishi Electric works closely alongside customers to develop value-added solutions that address today’s complex challenges while enhancing the company’s sustainable corporate value. Founded in 1921, Mitsubishi Electric has over a century of experience in delivering reliable, high-quality products and solutions. With over 200 group companies and approximately 150,000 employees worldwide, the company is a recognized global leader in manufacturing, marketing and selling electrical and electronic equipment and systems across a broad range of sectors, including public utility systems, energy systems, defense and space systems, factory automation systems, automotive equipment, building systems, air conditioning systems & home products, digital innovations, and semiconductor & devices. Mitsubishi Electric recorded consolidated revenue of 5,894.7 billion yen (U.S.$ 36.8 billion*) in the fiscal year that ended on March 31, 2026. For more information, please visit www.MitsubishiElectric.com *JPY 160=USD 1, the approximate rate on the Tokyo Foreign Exchange Market on March 31, 2026