30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday showcased modular container built on NVIDIA DSX POD, the fastest path to productive intelligence at scale, to its annual technology fest in Taipei.

NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories inside modular containers, integrated and validated before delivery. The units arrive ready to connect out of the box to a prepared site’s power, cooling, networking and other supporting infrastructure, reducing deployment time from six months to as little as 14 days. Partners, including Foxconn, complete rack-to-rack cabling, wiring, piping and functional validation before shipment.

The DSX POD-based modular container at the 7th annual Hon Hai Tech Day 2026 (HHTD26) represents the strong, long-standing collaboration between NVIDIA and Foxconn and comes on the heels of its recent announcement at NVIDIA GTC Berlin.

HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference is attracting thousands of attendees. Free entry on the second day, a family-friendly pavilion opens for the first time for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city.