＊On Monday, June 1, 2026, Foxconn, Radiall and Thales laid the foundation stone for their future joint venture at Le Barp (Nouvelle-Aquitaine) as part of the Choose France 2026 Summit, in the presence of the French Minister Delegate to the Minister of the Economy, Finance, and Industrial, Energy and Digital Sovereignty, responsible for Industry, Mr. Sébastien Martin, the President of S Business Group for Hon Hai Technology Group (Foxconn), Dr. Bob Wei-Ming Chen, the Chairman and CEO of Radiall, Mr. Pierre Gattaz, the Chairman and CEO of Thales, Mr. Patrice Caine and the President of the Nouvelle-Aquitaine Region, Mr. Alain Rousset.

＊This company, called Tessalia Technology SAS, will be dedicated to Outsourced Semiconductor Assembly and Testing (OSAT). It aims to produce more than 50 million System in Package (SiP) components per year by 2033.

＊Within the framework of the EU chips act, this project represents a major step forward in strengthening the French and European semiconductor ecosystem, increasing its capacity for innovation, strategic autonomy and competitiveness.

One year after the announcement by the President of the French Republic, Mr. Emmanuel Macron, at the Choose France 2025 Summit, of the initiation of preliminary discussions among Hon Hai Technology Group (Foxconn), Radiall and Thales, the three companies laid the foundation stone of their future joint venture at Le Barp, near Bordeaux (Nouvelle-Aquitaine), on Monday, June 1, 2026. Le Barp is located in the heart of a rich academic and industrial ecosystem, close to the “Route des Lasers” and with the presence of numerous cleanrooms and a large pool of expertise in these fields.

Foxconn, the world’s largest electronics manufacturing service provider, Radiall, a leading French manufacturer of high-performance interconnect solutionsfor demanding industries, and Thales, a global leader in advanced technologies, have named this new company Tessalia, referring to the tiles of a mosaic (from the Latin “tessella”). They are combining their strengths to create, test and assemble advanced packaging solutions for electronic chips (Systems in Package, SiP) for aerospace, telecom infrastructure, automotive and medical sectors notably. Tessalia will use an innovative encapsulation technology aimed at developing ultra-high-density packaging. This will help simplify printed circuit boards (PCBs) and create smaller, lighter components, thereby improving their integration capability. This technology is emerging as a breakthrough in terms of yields and competitiveness for future products.

Tessalia aims to:

-        Be a sovereign and competitive company to meet European needs in the field of semiconductor packaging in strategic sectors. Tessalia will have access to the technology from Foxconn under agreed licensing arrangements.

-        Provide to its customers a single interface to manage the entire implementation of advanced packaging for electronic chips. This vertical approach simplifies the packaging stage and guarantees reduced cycle time. It also minimises the carbon footprint of the sector by reducing round trips with multiple suppliers distributed worldwide;

-        Promote an autonomous and open player able to manage the European packaging market ecosystem.

Production is expected to start at the end of 2029 and to reach more than 50 million System in Package (SiP) components per year by 2033. This initiative aims to welcome other industrial players to support an investment that could exceed €250 million by 2033. Tessalia is expected to have 800 employees at full production.

In a context of surging demand for electronic equipment and artificial intelligence, and of geopolitical tensions disrupting global supply chains, semiconductor production has become a major strategic challenge, leading to a readjustment of the sector, an acceleration of production capacities and the development of new technologies.

“This new advanced capacity is a key sovereign asset for the European and French semiconductor industry. This project aligns perfectly with Radiall’s strategy, enabling the development of our next advanced connection solutions for demanding applications.” Pierre Gattaz, Chairman and CEO, Radiall

“This is not just a factory. It is a strategic platform for advanced manufacturing, semiconductor resilience, and future technologies in Europe. This project also supports Foxconn’s strategy of Build-Operate-Localize, which expands our global technology footprint through trusted partnerships.” Young Liu, Chairman, Foxconn

“The laying of this first stone today demonstrates our shared ambition, together with Radiall and Foxconn, to build an innovative and competitive European player in the advanced semiconductor packaging market, in a context of strong competition. Tessalia is part of a drive for independence and control over the value chain of all our electronic products.” Patrice Caine, Chairman and CEO, Thales

“I am delighted to welcome this strategic factory, which is crucial for our sovereignty in the electronics sector. It strengthens our regional ecosystem in this sector, which already represents 20,000 jobs. This project also rewards our long-standing efforts in reindustrialization, which have enabled us to become the leading region in France in terms of creating factories”. Alain Rousset, Président, Nouvelle-Aquitaine Region