·   Advance development of competitive, zero-emission buses in Japan ·   Combines FUSO’s bus design, development and manufacturing expertise with Foxconn’s ZEV technology and global partnership network ·   New company to be established from H2 2026Mitsubishi Fuso Truck and Bus Corporation (Headquarters: Kawasaki City, Kanagawa Prefecture, President and CEO: Karl Deppen, hereafter: MFTBC) today announced plans to create a standalone bus company with partner Hon Hai Technology Group (TWSE:2317), Headquarters: Tucheng, New Taipei City, Chairman and CEO Young Liu, hereafter: Foxconn). Katsuto Kora (currently Director, Head of FUSO BUS, Mitsubishi Fuso Truck & Bus Corporation) is designated as the new company’s CEO.   The two companies previously announced the signing of a memorandum of understanding to explore strategic collaboration in zero emission, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer. Via their subsidiaries - Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – MFTBC and Foxconn plan to cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.   Today’s announcement marks the next stage in the companies’ collaboration. The new company aims to fulfil society’s demand for high quality public transportation by accelerating the development of competitive, zero-emission buses in addition to the current diesel lineup. The buses will be developed and manufactured at the company’s plant in Toyama under the FUSO name, which already has over 90 years of heritage as a CV brand. The company will be headquartered in Kawasaki, Japan.   As a bus-dedicated OEM, the new company will focus on quickly developing and launching EV buses for domestic and international markets, while continuing to improve the conventional ICE portfolio.   With local development, sourcing, production and sales channels, the company will also be able to smoothly comply with Japanese regulations, quality standards and customer needs. This will be backed by Foxconn’s ZEV expertise, high-tech competency and global partnership network to help ensure products are successful in Japan and abroad.   Karl Deppen, CEO of MFTBC: “We are excited to join forces with Foxconn. This collaboration will combine the strengths of both parties to accelerate our transformation in the bus sector. By combining FUSO and Foxconn’s extensive experience and technological know-how, we will offer customers state-of-the art solutions for public transport, thereby contributing to society both in Japan and abroad.”   “Mobility is a strategic priority for Foxconn,” said Jun Seki, Foxconn Chief Strategy Officer for EVs. “This collaboration with MFTBC will provide a comprehensive electrification solution for Japan’s transportation ecosystem. This approach will significantly shorten development cycles and enhance cost-efficiency.”   Katsuto Kora, designated CEO of New Bus OEM: “The new joint venture will integrate the corporate cultures of both companies, blending Japan’s spirit of manufacturing excellence with Foxconn’s agility and technological prowess. Given the extensive existing partnerships of both shareholders, we expect even broader collaboration opportunities in the field of future technologies in the years to come. Our focus will be on meeting customer expectationsnot only for current conventional ICE improvement but also for zero-emission transportation and leading FUSO bus into a new era of digitalization and electrification.”   Having signed the definitive agreements today, MFTBC and Foxconn aim to close the transaction in the second half of 2026. The transaction is subject to all parties involved reaching an agreement and receiving approval from the relevant Boards, shareholders and authorities. MFTBC at a Glance Mitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.   Foxconn at a Glance Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   Foxtron at a Glance Established in 2020, Foxtron Vehicle Technologies is Taiwan’s only company with full vehicle design, development, and system validation capabilities. Leveraging decades of expertise from Hon Hai Technology Group (Foxconn) and Yulon Group in the ICT and automotive industries, Foxtron operates under the CDMS (Contract Design and Manufacturing Service) business model. With an open platform strategy, Foxtron aims to “Root in Taiwan, Expand Globally”, working alongside Taiwan’s ICT and automotive industries to drive international expansion and establish the next-generation EV ecosystem.   MFBM at a Glance Founded in1950, Mitsubishi Fuso Bus Manufacturing (MFBM) has been delivering high-quality buses to satisfied customers for over 75 years. With a state-of-the-art production facility located in Toyama, the company has achieved certification to international quality and environmental standards (ISO9001 since 2001, ISO14001 since 2003 and ISO/IATF16949 since 2018). MFBM manufactures its light duty ‘Rosa’ bus in dozens of markets worldwide and also produces large buses for both the long-distance coach (Aero Queen/Aero Ace) and city (Aero Star) segments.

15 January 2026, Taipei, Taiwan – The World Economic Forum (WEF) has recognized Vietnam’s first Sustainable Lighthouse in a world-class manufacturing facility operated by a subsidiary of Hon Hai Technology Group (“Foxconn”) (TWSE:2317), advancing the cleaner, greener and smarter leadership of world's largest electronics manufacturer and leading technological solutions provider. The benchmark designation of Foxconn Industrial Internet’s (Fii) operations in the Bac Ninh Province is the result of tangible achievements in accelerating decarbonization across complex manufacturing supply chains through the extensive application of AI technologies, achieving a 22% reduction in Scope 3 emissions, as well as a combined 34% reduction in Scope 1 and Scope 2 emissions. The recognition is a step up for the facility which was certified as Vietnam’s first WEF Lighthouse factory* in 2024. WEF Lighthouse Factories represent the highest global standards in smart manufacturing and digitalization. Sustainable Lighthouse Factories, seen as “lighthouses among lighthouses,” specifically recognize industry leaders that set exemplary benchmarks in carbon reduction and circular economy practices. In addition to meeting stringent requirements for technological advancement and operational excellence, Sustainable Lighthouse Factories emphasize performance improvements in energy efficiency, resource conservation, pollution reduction, carbon mitigation, and cost optimization. To achieve these goals, Foxconn’s Bac Ninh plant fully leveraged AI technologies to build a GenAI-based intelligent campus platform that integrates production, operations, energy management, carbon tracking, and EHS systems. This enables real-time insights and automated optimization, establishing a benchmark smart manufacturing campus. According to WEF, “Foxconn’s Bac Ninh plant has deployed more than 20 digital and AI-driven solutions, including AI-enabled green design to reduce the carbon footprint of bills of materials, a generative AI-based carbon accounting platform designed specifically for small and medium-sized suppliers, and energy efficiency optimization solutions integrating Omniverse and AI technologies.” Addressing common industry challenges such as the lack of effective carbon management tools and difficulties in advancing supplier decarbonization, the Bac Ninh plant developed an expert large-model–based carbon management platform and made it freely available to suppliers. Through standardized data reporting and automated verification, the platform increased Scope 3 emissions visibility to 90%. By combining analytical results, it also provides over 100 customized carbon reduction solutions tailored to different supplier profiles, precisely tackling supply chain decarbonization bottlenecks. (* Note: Under Vietnam’s administrative reform, Bac Ninh and Bac Giang provinces were officially merged in July 2025.)   About Foxconn here.

14 January 2026, Taipei, Taiwan – The LPGA of Taiwan (TLPGA) and the Japan Ladies Professional Golfers’ Association are thrilled to announce the “2026 Taiwan Foxconn Ladies Golf Tournament” on the official circuit of JLPGA for this year, bringing Asia’s most lucrative women’s golf tour to Taiwan for the first time in nearly half a century and an elite line-up of athletes vying for a record US$2 million purse. Stepping up the game, the competition – re-branded from Foxconn TLPGA Players Championship of the past two years – will see the return of title sponsor Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technological solutions provider, and special sponsor for the first time, Japanese technology powerhouse SoftBank Corp. Producing topflight golfers, including Hisako Higuchi and Ai Miyazato, the JLPGA was a sweet spot for Taiwan’s own golf legend Ai-yu Tu, who once swept 71 championships and was a 7x money-title winner on the JLPGA Tour, accumulating over 110 wins in her career and inducted into the Japanese Golf Hall of Fame. Ms Tu is a special advisor for the 2026 Taiwan Foxconn Ladies Golf Tournament. TLPGA Chairwoman Huang Pi-hsun said: "Ms Tu’s glorious achievements on the JLPGA Tour have been a source of pride for Taiwan. I am grateful for Foxconn's support, which has allowed this dream tour to return to Taiwan after 48 years, giving young players a stage to challenge the world." JLPGA Vice President Takako Matsuo said: "Over the past two years, we have witnessed TLPGA and Foxconn successfully taking the game to an elite playing level. As one of Asia’s flagship tournaments this year, we very much look forward to bringing Japanese players to Taiwan in March for high-level competition." The total purse is the second-highest in the JLPGA Tour for 2026 and another record for the Foxconn-sponsored tournament since it was inaugurated in 2024. Originally established as a players championship, the competition has set itself apart with its exceptional ranking points, substantial prize money, and elite sportsmanship. The 2026 Taiwan Foxconn Ladies Golf Tournament will be held March 12-15 at the Orient Golf & Country Club in Taoyuan. Follow the action and stay updated through the tournament’s official Facebook and on Foxconn’s official Instagram. About TLPGA here. About Foxconn here.

Hon Hai Technology Group (“Foxconn”) (TWSE:2317), world’s largest electronics manufacturer and leading technological solutions provider, and Pace CCS, the global leader in carbon capture and storage (CCS) design, today announced a major step in solving a key challenge for the CCS industry. The companies have begun operations at a new laboratory in Taipei to develop a chemical injection unit to prevent corrosion in CCS networks. This partnership combines Foxconn’s expertise in precision manufacturing with Pace CCS’s specialized design knowledge. It demonstrates how cross-industry collaboration can advance the shared goal of fighting climate change. Carbon capture and storage is a critical technology for achieving Net Zero emissions. The global demand for carbon capture is estimated at eight billion metric tons of CO2 annually, requiring trillions of dollars in investment. A key technical challenge is protecting CCS infrastructure from corrosion. Chemical reactions within the CO2 stream can create corrosive products such as sulfuric acid and nitric acid. These reactions can also produce water and solids, which lead to corrosion, erosion, and clogged disposal wells. The new laboratory will prove the efficacy of a chemical scavenger, already used in industries including semiconductor manufacturing. The goal is to show it can prevent the formation of these damaging acids and water under real-world CCS conditions. “This is the solution the CCS industry has been waiting for,” said Matthew Healey, Pace CCS Managing Director. “By turning a major technical challenge into a simple operational expense, we’re accelerating global CCS deployment.” “Foxconn is proud to bring our supply chain expertise to the energy transition,” said Ron R. T. Horng, Foxconn’s Chief Environment Officer. “This collaboration shows how cross-industry partnerships can drive meaningful progress against climate change.”   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   About Pace CCS Pace CCS are the global leaders delivering design for CCS projects, with experience with well over 100 CCS projects worldwide. Pace CCS are based in London and Kuala Lumpur. To learn more, visit www.paceccs.com.

Taipei, Dec. 23, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn) announced that its key automotive electronics product, the Telematics Control Unit (TCU), has successfully passed DEKRA process certification and obtained both ISO 26262 Functional Safety certification and ISO/SAE 21434 Automotive Cybersecurity certification. This milestone places FIH among a limited number of companies in the TCU domain to concurrently obtain both certifications, significantly reinforcing its strategic role in the global automotive electronics supply chain. Aaron Lee, Managing Director of DEKRA Taiwan (right), presented the ISO 26262 and the ISO/SAE 21434 Certifications to Dr. Wen Kuo, Vice President of FIH.  Dr. Wen Kuo, Vice President of FIH, stated, “By implementing ISO 26262 and ISO/SAE 21434, FIH has established a comprehensive safety lifecycle management framework that enables customers to reduce system integration risks, accelerate validation timelines, and meet increasingly stringent regulatory requirements. Backed by our deep expertise in the ICT industry, as well as our capabilities in independent design, high-quality manufacturing, and system integration, FIH is committed to delivering robust, secure, and reliable solutions and becoming a long-term, trusted partner for global automakers.”   As the automotive industry accelerates toward electrification and Software-Defined Vehicles (SDVs), functional safety and cybersecurity have become essential thresholds for global OEMs when evaluating Tier-1 suppliers. ISO 26262 is the internationally recognized standard for automotive functional safety, ensuring that electronic and electrical systems remain controllable under fault conditions. Meanwhile, ISO/SAE 21434 establishes a comprehensive cybersecurity framework for road vehicles, encompassing threat analysis, risk assessment, governance, and lifecycle management. Together, these two standards form a core foundation for smart and connected vehicles and are indispensable to the transition toward autonomous driving and SDVs.   As the communication hub of smart and connected vehicles, the TCU supports functions including remote diagnostics, connected vehicle services, vehicle data transmission, and over-the-air (OTA) updates. Its functional safety and cybersecurity protection levels directly impact the stability and risk management of the entire vehicle system. Through the successful attainment of both ISO 26262 and ISO/SAE 21434 certifications, FIH has demonstrated that its capabilities in hardware design, software architecture, secure communications, and cybersecurity protection meet the rigorous requirements expected by leading global automakers.   As global automotive electronic architectures and Software-Defined Vehicles (SDVs) continue to evolve rapidly, safety and cybersecurity requirements across automakers’ supply chains have become increasingly stringent. “FIH’s ability to complete both certifications within a single year and to its achievement in the TCU domain reflects its strong R&D execution and well-established management systems. This achievement aligns closely with global automakers’ expectations for safety, quality, and cybersecurity and represents a highly meaningful industry milestone. We are pleased to witness this accomplishment together with FIH,” said Aaron Lee, Managing Director of DEKRA Taiwan. FIH’s Automotive Electronics team poses for a group photo with the expert team from DEKRA.About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.   For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

18 December 2025, Taipei, Taiwan – The Hon Hai Research Institute (HHRI) is pleased to announce the successful completion of Round 1 of the Australian Quantum Software Network (AQSN) Micro & MesoGrant Scheme. In this inaugural round, HHRI, as the key sponsor, awarded more than AUD 150,000 in competitive funding to support early-career and mid-career researchers across Australia in advancing quantum software and algorithmic research. The AQSN MicroGrant / MesoGrant programs are funding schemes designed to support research in quantum algorithms, quantum software, and quantum theory. AQSN members—including students and researchers—may apply. The MicroGrant is suitable for short-term or early-stage open-source projects, while the MesoGrant supports mid-scale or collaborative research efforts. Funded projects typically run for 6–12 months and require outcomes to be open-sourced and publicly shared, fostering collaboration and knowledge exchange within the quantum software community. AQSN founder and Review Committee member Dr. Simon Devitt stated: ”We sincerely appreciate the support from the Hon Hai Research Institute’s Quantum Computing Research Center and the enthusiastic participation of the Australian quantum research community. Congratulations to all the award recipients. HHRI’s generous sponsorship has enabled AQSN to empower the next generation of quantum pioneers and to build a vital bridge between academic excellence and industrial impact. We are honored to collaborate with HHRI in establishing a strong software foundation for the quantum era.” Dr. Min-Hsiu Hsieh, Director of HHRI’s Quantum Computing Research Center, said:“Scientific breakthroughs often originate from a small yet bold idea. At the Hon Hai Research Institute, we are committed to becoming a catalyst for innovation. By supporting AQSN’s young scholars, we hope to inject fresh momentum into the field of quantum computing. This collaborative initiative represents HHRI’s commitment to nurturing the next generation of quantum talent, and we look forward to seeing students and researchers become key forces driving global quantum technology development.” A total of 9 projects were selected, including six MicroGrants and three MesoGrants fully sponsored by HHRI. These projects reflect the depth and creativity of Australia’s quantum research community, ranging from foundational theory to practical algorithmic development. The successful recipients and their project topics are listed below: MesoGrant Recipients 1.       Clément Canonne (University of Sydney) — Towards Understanding Which Quantum Circuits Can Be Classically Sampled 2.       Harini Hapuarachchi (RMIT University) — Towards a Unified Software Toolkit to Simulate Noise in Diamond-Based Room-Temperature Spin Qubits 3.       Angus Southwell (Monash University) — Quantum Gibbs Sampling via Simplicial Complexes MicroGrant Recipients 1.       Jonas Freiheit (RMIT University) — Optimising Encoding & Readout for Quantum Reservoir Computing Based on Quantum Ising Models 2.       Elija Perrier (University of Technology Sydney) — Coherent Learning for Quantum Agents 3.       Abhinash Kumar Roy (Macquarie University) — Resource-Efficient Characterisation of Multi-Time Quantum Processes 4.       Varun Srivastava (Macquarie University) — Randomised Benchmarking as a Diagnostic for Non-Markovian Noise and Fault-Tolerance Thresholds 5.       Mingyu Sun (University of Technology Sydney) — Scalable Fidelity Estimation and Learnability from Local Measurements 6.       Tianhui Zhu (UNSW) — Implementing Virtual Distillation with Quantum Algorithms HHRI extends its gratitude to the AQSN assessment committees and the entire Australian quantum research community for their enthusiastic participation. Congratulations to all awardees. Hon Hai Research Institute remains committed to supporting quantum research and innovation worldwide, fostering academic collaboration, and accelerating the development of next-generation quantum technologies. We look forward to supporting future rounds of this scheme and the exciting research that will emerge as a result. About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy. To learn more, visit https://www.hh-ri.com

Taiwan’s global impact in quantum technology shines in IYQ 202517 December 2025, Taipei, Taiwan – In recognition of his long-standing contributions to advancing quantum research, education, and industry collaboration, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) Board Director Ching-Ray Chang has been selected as an honoree in the global Quantum 100, the flagship initiative in IYQ 2025, the United Nations-designated International Year of Quantum Science and Technology. Professor Chang, who is also Distinguished Chair Professor at Taiwan’s Chung Yuan Christian University and Quantum Technology Advisory Committee Member of the Hon Hai Research Institute, has provided strategic guidance on Foxconn’s quantum technology roadmap and research direction in recent years. His contributions are supporting the Group’s efforts to align its quantum R&D capabilities with the global ecosystem, and its manufacturing capabilities for ion-trap quantum computers. Marking the 100th anniversary of the birth of quantum mechanics, the United Nations General Assembly designated 2025 as the International Year of Quantum Science and Technology (IYQ 2025), with the United Nations Educational, Scientific and Cultural Organization (UNESCO) launching the Quantum 100, a flagship initiative to celebrate the diverse people behind quantum science and technology. Professor Chang has played a central role in building Taiwan’s quantum research and education infrastructure. Authoring more than 280 academic papers and holding over 28 patents, he actively engages in popular science writing and public outreach, making complex quantum concepts accessible and fostering greater societal understanding of quantum technology. Professor Chang previously served as Executive Vice President and Acting President of National Taiwan University (NTU), where he founded the NTU–IBM Quantum Hub, now recognized as one of the most active academic quantum centers in Asia, and put quantum computing into NTU’s formal curriculum. He established a quantum information center at Chung Yuan Christian University (CYCU), led national-level quantum training programs, and pioneered the introduction of quantum education at both high school and university levels, systematically cultivating Taiwan’s next generation of quantum talent. Professor Chang is Founding President of the Taiwan Association of Quantum Computing and Information Technology (TAQCIT), where he helped shape Taiwan’s national quantum technology development roadmap and strengthened coordination across academia, industry, and government, including the Quantum Taiwan Forum, a key platform connecting Taiwan’s semiconductor strengths with the global quantum technology ecosystem.

Las Vegas, Taipei, Dec. 16, 2026 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will participate in CES 2026 from January 6 to 9. Under the theme "Driving the Future of Smart Mobility," FIH will showcase its core automotive electronics solutions, including the latest High-Performance Computing (HPC) platform, In-Vehicle Infotainment (IVI) systems, Advanced Driver Assistance Systems (ADAS), and Telematics Control Units (TCUs).To demonstrate the centralized computing power and system integration capabilities of the HPC platform, FIH will present an interactive demo vehicle that allows visitors to control various car functions via the IVI interface to experience seamless operation.   FIH Vice President Dr. Wen Kuo stated, "The automotive industry has shifted from being primarily mechanical-driven to software-centric, which requires powerful centralized computing performance, software update capabilities, and cybersecurity resilience. With extensive experience in electronics product R&D, manufacturing, and system integration, FIH is well-positioned to provide automotive electronics solutions that align with industry trends, enabling automakers to accelerate transformation and enhance deployment flexibility."   FIH's HPC platform offers several advantages to support automakers in developing Software-Defined Vehicle (SDV):   l   Powerful Centralized Computing Capabilities: In addition to IVI and ADAS integration, the HPC platform also supports body control functions, e.g. window control, seat, light control, etc. The total product cost will be optimized for car OEMs. l   Electrical/Electronic Architecture (E/EA) Optimization: Streamlines the traditional Electronic Control Unit (ECU)-intensive distributed architecture by leveraging Zone Control Unit (ZCU), improving overall system collaboration. l   Accelerated Deployment of Innovative Features: Supports real-time Over-the-Air (OTA) software updates across all systems, helping automakers quickly deploy new features and reduce maintenance costs.   FIH will also present its TCU product line, including the e-Call certified 4G product supplied to a dozen globally renowned auto brands; the 5G variant that supports seamless cloud integration, real-time diagnostics, and high-speed data transmission; and modem-only models customizable for various requirements. In addition, FIH offers a multi-modem, multi-network TCU that enables carmakers to achieve level 4 autonomous driving and remote vehicle operation.   FIH's world-class TCU solutions have obtained ISO 26262 functional safety and ISO/SAE 21434 cybersecurity engineering certifications, as well as compliance with international standards such as ASPICE CL2, UN ECE R155 for cybersecurity, and R156 for software updates, demonstrating FIH’s comprehensive cybersecurity readiness and ensuring safe and reliable large-scale deployment.   In addition to its automotive electronics solutions, FIH will also showcase its self-designed Ku and Ka-band LEO user terminals, which integrate flat-panel phased array antenna system that can be applied to diverse scenarios such as maritime, land mobility, and aviation, supporting customers in deploying next-generation 6G communications.   Leveraging over two decades of experience in wireless communications and ICT, as well as extensive development and integration capabilities in mobile phones and IoT products, FIH continues to deepen its three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics. Through its global footprint and flexible production strategies, FIH aims to create exceptional value for customers worldwide.   Welcome to visit us at Booth No. 4167, West Hall, Las Vegas Convention Center.     CES 2026 FIH Exhibition Information: l   Dates: January 6 to January 9, 2026 (Tuesday to Friday) l   Location: Las Vegas Convention Center, the U.S. l   Booth Number: No.4167 About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.   For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

11 December 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world's largest electronics manufacturing service provider, has been honored with five Greater China awards recognizing its longstanding commitment to transparent, effective, and insightful communication with investors by the globally renowned IR Impact, formerly known as IR Magazine. Shortlisted as finalist for seven awards, Foxconn took home Best in Sector – Technology, Best Buy-side Management, Best CEO Letter, Best Investor Relations Officer, and Rising Star, making it the most awarded Taiwanese company in the Greater China region for the fifth consecutive year and turning in Foxconn’s strongest performance yet in its history in the IR Impact Awards. Foxconn Vice President and Spokesperson James Wu said, “This year’s awards show that everyone is committed to elevating investor communication and service – from the CEO to our IR leadership to new team members. As a global technology leader, Foxconn not only maintains technological excellence, but also places strong emphasis on investor engagement. Winning these five awards is the greatest affirmation for the Group and our IR team.” Foxconn received the most nominations among the 18 Taiwan companies that were finalists in the Greater China IR Impact Awards. The wins in newly-introduced awards for Best Buy-side Management and Best CEO Letter reflect Foxconn’s strong top-down commitment to timely, high-quality, and insight-driven investor communication. Of note were honors to two IR officers that highlight the Group’s commitment to women in leadership, innovative use of AI in the workplace and deepening IR influence. In the Best Investor Relations Officer category, Senior IR Manager Kristen Fang won the award for the second consecutive year, demonstrating her exceptional professionalism and influence in international capital markets. This is her second global IR individual award this year. IR team member Maggie Tsai was recognized as Rising Star, her first IR Impact recognition, for her focus in transforming IR into a strategic function that enhances both external understanding and internal decision-making via innovative methods such as use of a proprietary AI-powered intelligence hub and pioneering groundbreaking Group Investor Conferences and industry forums. Formerly known as IR Magazine, IR Impact is one of the most influential global platforms in the IR and capital markets community, serving as a key bridge between companies, investors, and the broader market. The IR Impact Awards are among the most authoritative recognitions in the IR field, voted on by institutional investors and analysts to acknowledge excellence in IR communication, transparency, AI adoption, innovation, and corporate governance. In previous years, Foxconn has won IR Impact awards in categories such as Best IR Website, Best Use of Multimedia for IR, Best Investor Event, Best Innovative Shareholder Communication, and Best Use of Technology (Including AI). The IR team continues to leverage diverse communication channels to help investors better understand Foxconn’s value while actively benchmarking global best practices, driving innovation, and enhancing investor services to create greater value for both the company and its shareholders. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com